Curved Electronic Layer Bonding to Prevent Peeling and Offset
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Solution Overview
Problem
Existing manufacturing processes of curved electronic devices face issues such as peeling and/or offset of laminated layers due to differing thermal expansion coefficients, leading to manufacturing inefficiencies.
Innovation Solution
A method involving the formation of a curved substrate followed by sequential deposition of conductive layers on insulating layers, with adhesive layers to secure the insulating layers to the substrate, and maintaining specific distances and orientations to reduce layer separation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Shape
If laminated conductive layer, insulating layer and substrate are heated to form a curved laminated body, then the electronic device achieves a curved shape, but the layers are prone to peeling and offset due to different thermal expansion coefficients
Solution Approach 1:
The patent applies preliminary action by forming the curved shape of the substrate before depositing the conductive and insulating layers. The substrate is pre-curved through a shaping process, then subsequent layers are formed on this pre-shaped substrate, avoiding the need to heat and curve the entire laminated structure together. This prevents thermal expansion mismatches from causing layer separation while achieving the desired curved form factor.
2Shape
If laminated conductive layer, insulating layer and substrate are heated to form a curved laminated body, then the electronic device achieves a curved shape, but the device suffers from peeling and offset problems
Solution Approach 1:
The substrate is pre-curved before layer lamination, eliminating the need for post-lamination heating to achieve curvature. This prevents thermal stress-induced peeling and maintains reliable layer bonding throughout the device structure.
Solution Approach 2:
The manufacturing process is segmented into distinct stages: substrate shaping is completed separately before layer deposition. This segmentation allows each layer to be formed independently on the pre-shaped substrate without thermal stress, ensuring reliable bonding while maintaining the curved geometry.
3Shape
If conventional heating method is used to form curved laminated body, then the substrate achieves curved shape, but manufacturing efficiency decreases due to quality issues
Solution Approach 1:
By pre-forming the substrate curvature before layer deposition, the patent eliminates rework and scrap associated with heating-induced layer separation. This improves manufacturing yield and efficiency while maintaining the desired curved shape, as layers bond reliably without thermal stress.
Solution Approach 2:
Separating the substrate shaping process from the layer lamination process allows for optimized manufacturing of each component independently. The substrate can be curved using efficient methods without compromising layer integrity, thereby improving overall production efficiency and yield.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Reduces the likelihood of peeling and damage to conductive layers, enhancing manufacturing yield and device integrity.
Implementation Method 1
An adhesive layer is disposed between the first insulating layer and the substrate and/or between the second insulating layer and the substrate
Data Source
AI summary
A manufacturing method of an electronic device includes the following steps. First, a curved substrate is formed. Next, a first conductive layer is formed on a first insulating layer. Then, a second conductive layer is formed on a second insulating layer. Thereafter, the first insulating layer and the second insulating layer are bonded to the curved substrate. The manufacturing method of the electronic device may reduce problems such as peeling and/or offset of the manufactured electronic device.