Curved LED Module PCB Apertures for Lower Bending Stress
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Solution Overview
Problem
Easily curved LED display modules face challenges in bending flexibility due to high tensile stress, which can lead to damage and limit their ability to be effectively curved into various shapes without compromising structural integrity.
Innovation Solution
Incorporating apertures through the printed circuit board (PCB) filled with an insulating medium, such as air or softer materials, between LED locations and chipsets, which reduces tensile stress and allows for easier bending without extending to the PCB edges, with a density of apertures ranging from 6% to 12% of the PCB's outer surface area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the PCB is made rigid to maintain structural integrity, then strength is improved, but bending flexibility deteriorates
Solution Approach 1:
The patent introduces apertures (through-holes) in the PCB, creating a porous structure that reduces tensile stress during bending. These apertures allow the PCB to flex more easily while maintaining overall structural integrity, as the remaining material provides sufficient strength while the voids accommodate the stress of deformation.
Solution Approach 2:
The PCB is segmented by introducing multiple apertures that divide the continuous structure into regions separated by the holes. This segmentation allows different parts of the PCB to move independently during bending, reducing the overall tensile stress and improving flexibility while maintaining structural coherence through the distributed aperture pattern.
2Adaptability or versatility
If apertures are extended to the PCB edges to maximize flexibility, then bending flexibility is improved, but structural integrity deteriorates
Solution Approach 1:
The apertures are strategically positioned in specific regions of the PCB where tensile stress is highest during bending, rather than extending to all edges. This local quality approach concentrates the flexibility-enhancing apertures in critical stress zones while maintaining solid edge regions that provide structural support and integrity.
3Adaptability or versatility
If aperture density is increased to reduce tensile stress, then bending flexibility is improved, but manufacturing complexity increases
Solution Approach 1:
The patent applies a moderate aperture density (6-12% of PCB area) rather than maximizing aperture quantity. This partial action approach provides sufficient flexibility improvement while avoiding excessive manufacturing complexity. The optimized density achieves the necessary stress reduction without requiring overly complex aperture patterns or excessive hole drilling operations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly decreases tensile stress by 50%, enabling the PCB to be easily bent and curved, enhancing the display module's flexibility and durability while maintaining structural integrity.
Implementation Method 1
the aperture is filled with an insulating medium selected from a group comprising of air and a material which is softer than that of PCB board
Data Source
AI summary
The patent application discloses an easily curved LED system. The LED system may comprise a printed circuit board (“PCB”). The PCB may have at least one layer. An aperture through all layers of the PCB may exist and may be interposed between a location for a LED at a first side of the PCB and a location for a chipset on a second side PCB board.