Curved Flow-Opening Liners for Semiconductor Chamber Leakage Control
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Solution Overview
Problem
Existing semiconductor processing chambers face issues with corrosion, deposition, and contamination due to gas leakage and condensation, leading to reduced component lifespan and non-uniform material deposition.
Innovation Solution
The introduction of liners with curved flow openings extending at least partially about the chamber components, allowing for controlled gas flow paths that reduce leakage and condensation, and the use of chamber kits and processing chambers designed to enhance gas flow management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional chamber components are used without specialized flow openings, then the structure is simpler, but gas leakage and condensation occur leading to corrosion and contamination
Solution Approach 1:
The liner is segmented into multiple functional zones with specific flow openings positioned at different locations. The first flow opening receives process gas while the second flow opening receives purge gas, allowing separate gas flow paths that prevent contamination and corrosion of chamber components.
Solution Approach 2:
The liner acts as an intermediary component between the gas supply system and the chamber components. By incorporating flow openings that direct process gas and purge gas to specific locations, the liner mediates gas flow to prevent direct contact between reactive gases and chamber components, thereby reducing corrosion and contamination.
2Manufacturing precision
If gas flow is not properly controlled, then the system is simpler to operate, but non-uniform material deposition occurs
Solution Approach 1:
Different regions of the liner are designed with different flow characteristics. The first flow opening is positioned to deliver process gas to specific areas while the second flow opening delivers purge gas to other areas. This local differentiation of gas flow quality ensures uniform material deposition by preventing gas starvation or excessive gas flow in any particular region.
Solution Approach 2:
The gas flow control is extended into the spatial dimension by positioning flow openings at specific locations and orientations on the liner. The first flow opening and second flow opening are arranged in a configuration that creates three-dimensional gas flow patterns, ensuring uniform coverage across the substrate surface and improving material deposition uniformity.
3Object-affected harmful factors
If purge gas is not directed away from process gas, then the system is simpler, but contamination of processed substrates occurs
Solution Approach 1:
The gas flow paths are segmented into separate channels within the liner structure. The first flow opening is dedicated to process gas flow while the second flow opening is dedicated to purge gas flow. This segmentation prevents mixing of process gas and purge gas, ensuring that purge gas does not contaminate the substrate processing area.
Solution Approach 2:
The purge gas flow path is extracted and separated from the process gas flow path by positioning the second flow opening distinct from the first flow opening. This extraction allows purge gas to be directed away from the substrate processing zone, removing the harmful contamination effect while maintaining a relatively simple overall system structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design minimizes chamber component corrosion and contamination, reduces gas consumption, and ensures more uniform film growth, thereby extending component lifespan and improving deposition quality.
Implementation Method 1
A curved flow opening extends into the outer face and extends at least partially about the liner. The curved flow opening extends along an azimuthal angle greater than 90 degrees.
Data Source
AI summary
The present disclosure relates to liners having flow openings, and related chamber kits, processing chambers, and methods for semiconductor manufacturing. In one or more embodiments, a liner applicable for semi-conductor manufacturing includes an inner face and an outer face opposing the inner face. The liner includes an inlet opening extending into the inner face and an outlet opening extends into the inner face. The liner includes a curved flow opening extending into the outer face and extending at least partially about the liner. The curved flow opening extends along an azimuthal angle greater than 90 degrees.