Semiconductor Package Metal Post with Curved Waist
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Solution Overview
Problem
Current semiconductor packages face challenges in providing wider connection areas and efficient connectivity between processor dies and redistribution structures, particularly in integrating with DRAM modules through molding materials, which affects signal transmission and stress distribution.
Innovation Solution
A semiconductor device design featuring a metal post with varying widths and an inwardly curved side surface, connected to a redistribution structure, allowing for wider connection areas and improved connectivity through a molding material, enhancing signal transmission and reducing stress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If a conventional metal post with uniform width is used, then the structure is simple to manufacture, but the connection area is limited and stress distribution is poor
Solution Approach 1:
The metal post employs varying width along its length, with wider sections at connection points and a narrower middle section. This local variation in geometry provides larger connection areas where needed while maintaining structural integrity, resolving the contradiction between connection area and structural simplicity.
Solution Approach 2:
The metal post features an inwardly curved side surface rather than straight edges. This curvature optimizes stress distribution and enhances the connection area at the ends while maintaining manufacturability, addressing both the connection area requirement and structural complexity constraints.
2Reliability
If a metal post with wider connection areas is implemented, then connectivity and stress management improve, but manufacturing complexity increases
Solution Approach 1:
The metal post width parameter varies continuously along its length rather than remaining constant. This parameter change creates wider connection areas for improved reliability while the gradual transition maintains ease of manufacture through standard forming processes.
Solution Approach 2:
The inwardly curved side surface of the metal post optimizes stress distribution and enhances connection area without requiring complex manufacturing steps. The curvature can be achieved through conventional forming processes, maintaining ease of manufacture while improving reliability.
3Productivity
If the metal post connects through molding material to DRAM module, then integration efficiency improves, but stress concentration may occur
Solution Approach 1:
The inwardly curved side surface of the metal post distributes stress more evenly as it passes through the molding material to connect with the DRAM module. This curvature prevents stress concentration at sharp edges while maintaining efficient integration pathways.
Solution Approach 2:
The metal post features a narrower middle section that transitions smoothly through the molding material, with wider sections at connection points. This local variation in width optimizes stress distribution throughout the integration pathway while maintaining productivity.
Data Source
AI summary
A semiconductor device is disclosed. The semiconductor device comprises a redistribution structure, a processor die, and a metal post. The metal post has a first end, and a second end. The metal post is connected to the redistribution structure at the first end. The first end has a first width. The second end has a second width. The metal post has a waist width. The first width is greater than the waist width. The second width is greater than the waist width. The metal post has a side surface. The side surface is inwardly curved or outwardly curved.