Curved Optical Thin-Film Patterning Using 3D Laser Ablation
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Solution Overview
Problem
Existing methods for patterning thin films on curved optical surfaces, such as spectacle lenses, face challenges in achieving high accuracy due to variations in resist pattern formation and require cumbersome processing steps.
Innovation Solution
A method involving laser beam irradiation with three-dimensional control to remove thin films on curved optical surfaces, using laser beams with specific wavelength bands to ensure accurate patterning without damaging underlying substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the resist pattern is formed using the inkjet recording method on the curved optical surface, then the patterning process can be performed, but the resist pattern cannot be accurately formed due to variation in impact of the resist on the optical surface
Solution Approach 1:
The patent replaces the mechanical inkjet recording system with a laser beam system for patterning. The laser beam is focused onto the curved optical surface using a lens, eliminating the impact variation issues of inkjet methods. The laser directly ablates or modifies the thin film to create the desired pattern without requiring resist materials or complex deposition-removal cycles.
Solution Approach 2:
The patent changes the fundamental parameter of the patterning method from chemical (inkjet resist) to optical (laser beam). By adjusting laser parameters such as wavelength, pulse duration, and intensity, the method achieves high-precision patterning on curved surfaces. The laser wavelength is selected to match the absorption characteristics of the thin film material for optimal patterning.
2Manufacturing precision
If the resist pattern is formed and then removed to perform patterning, then the thin film can be patterned, but the processing steps become troublesome and complex
Solution Approach 1:
The patent extracts and eliminates the resist pattern formation and removal steps from the traditional patterning process. By using direct laser patterning, the method removes the intermediate resist layer requirement, simplifying the overall process to just the essential thin film deposition and direct laser patterning steps.
Solution Approach 2:
The patent introduces the laser beam as a direct intermediary between the patterning design and the thin film, eliminating the need for resist materials as intermediaries. The laser beam directly transfers the pattern information to the thin film through optical focusing and selective ablation or modification.
3Manufacturing precision
If a laser beam is used to remove the thin film for patterning, then high-accuracy patterning can be achieved on curved surfaces, but the laser wavelength must be carefully selected to avoid damaging the optical substrate
Solution Approach 1:
The patent applies local quality by selecting a laser wavelength that is specifically absorbed by the thin film material while being transparent to the optical substrate. This creates a localized effect where only the thin film is affected by the laser, leaving the substrate intact. The wavelength selection is tailored to the specific material properties of the thin film.
Solution Approach 2:
The patent employs beforehand cushioning by pre-selecting a laser wavelength that inherently protects the substrate from damage. The wavelength is chosen in advance based on the absorption characteristics of both the thin film and substrate, ensuring that the substrate is naturally shielded from harmful laser effects while the thin film is effectively patterned.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables high-accuracy patterning on curved optical surfaces with reduced processing steps, ensuring stable quality and uniformity of the optical member.
Implementation Method 1
in the removal step, the thin film is removed by being irradiated with a laser beam
Implementation Method 2
the laser beam is emitted using a laser processing machine that supports three-dimensional control of a focal position of the laser beam
Implementation Method 3
a laser beam that has a wavelength that belongs to a wavelength band where a difference between a transmittance of the optical substrate and a transmittance of the thin film is 1% or more is used as the laser beam emitted in the removal step
Data Source
AI summary
A film forming step of forming a thin film on an optical surface of an optical substrate, the optical surface having a curved surface shape, and a removal step of partially removing the thin film on the optical surface to perform patterning of the thin film. In the removal step, the thin film is removed by being irradiated with a laser beam.