Curved Package Routing to Prevent Die Corner Line Cracks

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Solution Overview

Problem

Existing semiconductor device packaging methods fail to adequately address the issue of conductive line cracks caused by stress concentration at the corners of semiconductor dies during thermal processes, leading to reliability issues.

Innovation Solution

Implementing non-linear or curved conductive lines in the stress concentration areas under the semiconductor die corners to disperse stress and prevent crack formation, using a semiconductor die package design that includes a package substrate with non-linear or curved routing patterns for conductive lines.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If linear conductive lines are used in conventional package substrates, then manufacturing is simple and straightforward, but stress concentration occurs at die corner areas leading to conductive line cracks

Engineering Contradiction:

Improveconductive line crack resistanceVSAvoidconductive line routing complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent applies curvature to conductive lines by implementing non-linear routing patterns (e.g., curved, zigzag, or meandering paths) instead of straight linear lines. This curvature distributes stress along the conductive line path, preventing stress concentration at specific points and thereby reducing crack formation in the die corner areas during thermal processes.

Inventive Principle:

Principle #14Spheroidality (Curvature)

2Reliability

If conductive lines are routed through die corner areas, then wiring connectivity is achieved, but stress concentration causes crack formation during thermal processes

Engineering Contradiction:

Improvethermal process stabilityVSAvoidconductive line routing simplicity

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The patent applies local quality by implementing non-linear routing specifically in the die corner areas where stress concentration occurs, while other areas may maintain simpler routing. This localized modification targets the problematic regions without unnecessarily complicating the entire conductive line network, balancing reliability improvement with manufacturing ease.

Inventive Principle:

Principle #3Local quality

3Manufacturing precision

If conventional linear routing is used, then manufacturing precision requirements are lower, but conductive line cracks occur due to stress concentration

Engineering Contradiction:

Improveconductive line fabrication precisionVSAvoidpackage substrate reliability

Core Design Contradiction:

Manufacturing precisionVSReliability

Solution Approach 1:

The curved or non-linear routing patterns require precise fabrication to maintain the intended stress-distributing geometry. The patent addresses this by ensuring the curved paths are accurately formed during manufacturing processes, thereby achieving both the desired stress distribution for reliability and the necessary manufacturing precision through controlled fabrication methods.

Inventive Principle:

Principle #14Spheroidality (Curvature)

Data Source

PatentUS12412827B2Semiconductor die package with conductive line crack prevention design

Publication Date: 2025.09.09 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

A semiconductor die package is provided. The semiconductor die package includes a semiconductor die and a package substrate supporting and electrically connected to the semiconductor die. The semiconductor die has a corner. The package substrate includes several conductive lines, and one of the conductive lines under the corner of the semiconductor die includes a first line segment and a second line segment connected to the first line segment. The first line segment is linear and extends in a first direction. The second line segment is non-linear and has a varying extension direction.