Curved PCB Assembly for Better Internal Space Utilization
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Solution Overview
Problem
Existing rigid-flex printed circuit boards have limited bendable areas, making it difficult to effectively utilize the internal space of electronic devices with curved shapes, and the area occupied by the board unit is not efficiently utilized due to the placement of electrical components only on the rigid printed circuit board portion.
Innovation Solution
A printed circuit board with a metal wiring layer and a polymer substrate layer laminated on at least one surface, where the polymer substrate layer is hot-shaped to have a curved shape, and a bonding layer using a solder to fix electrical components, allowing the board unit to conform to the device's shape, reducing the need for a separate flexible board portion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Shape
If a rigid-flex printed circuit board is used to conform to curved shapes, then the board can match the electronic device shape, but the bendable area is limited and internal space utilization is poor
Solution Approach 1:
The printed circuit board is divided into multiple layers: a flexible substrate layer that can be bent into curved shapes, a rigid support layer that maintains structural integrity, and a circuit layer with conductive patterns. This segmentation allows different portions to serve different functions - the flexible substrate conforms to curved surfaces while the rigid support prevents excessive deformation, thereby improving both shape conformity and space utilization.
Solution Approach 2:
The patent transitions from traditional two-dimensional flat PCBs to three-dimensional curved PCB structures by introducing a flexible substrate layer that can be bent along predetermined curvature radii. This dimensional change enables the board to conform to curved surfaces of electronic devices while maintaining electrical connectivity through the circuit layer, effectively utilizing internal space without compromising structural stability.
2Stability of the object's composition
If electrical components are placed only on the rigid printed circuit board portion, then structural stability is maintained, but the board unit area is not effectively utilized
Solution Approach 1:
The flexible substrate layer serves multiple functions: it provides a mounting surface for electrical components, maintains structural stability through its layered construction, and enables curved shape conformity. By making the flexible substrate layer component-mounted capable, the patent allows electrical components to be placed on both rigid and flexible portions of the board, thereby effectively utilizing the entire board unit area while maintaining structural integrity through the laminated structure.
3Shape
If a separate flexible board portion is used to achieve curved shapes, then shape conformity is improved, but the overall board unit area increases
Solution Approach 1:
The patent merges the flexible substrate layer, rigid support layer, and circuit layer into a single integrated printed circuit board structure. This unified design eliminates the need for separate flexible board portions connected to rigid boards, as the flexible substrate layer itself can be directly formed into curved shapes. The merging reduces the overall board unit area while maintaining curved shape conformity, as the flexible layer is thin and can be bent without requiring additional space for joints or connectors.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The internal space of electronic devices with curved shapes is effectively utilized, and the area occupied by the board unit is reduced, enhancing space efficiency.
Implementation Method 1
the polymer substrate layer being hot-shaped to have a curved shape
Implementation Method 2
a bonding layer including a solder that electrically bonds the electrical component to at least a portion of the metal wiring layer
Data Source
AI summary
An electronic device is provided. The electronic device including a board unit on which at least one electrical component is disposed, wherein the board unit includes a printed circuit board (PCB) including a metal wiring layer and a polymer substrate layer laminated on at least one surface of the metal wiring layer, the polymer substrate layer being hot-shaped to have a curved shape, and a bonding layer including a solder that electrically bonds the electrical component to at least a portion of the metal wiring layer, the bonding layer being configured to fix the electrical component on the board unit.