Curved Support Plate Bonding for Substrate Alignment Accuracy
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Solution Overview
Problem
The semiconductor industry faces challenges in achieving precise alignment and minimizing 'run-out' errors during substrate bonding due to distortions and variations in substrate alignment accuracy, leading to overlay errors that affect the entire manufacturing process.
Innovation Solution
A method and device that utilize a curved plate between substrates and a receiving device, where the plate is fixed and deformed to enhance bending resistance, reducing 'run-out' errors by creating a system with higher stiffness and flexibility control, allowing for precise full-surface contact and alignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If substrates are directly bonded without additional support structures, then the bonding process is simple, but alignment accuracy deteriorates due to substrate distortions and run-out errors
Solution Approach 1:
A support plate is introduced as an intermediary element between the substrate and the bonding interface. The plate has a first surface that contacts the substrate and a second surface that forms the bonding interface. This mediator provides mechanical support, reduces run-out errors, and improves alignment accuracy without requiring direct modification of the substrate itself.
Solution Approach 2:
The support plate changes the mechanical parameters of the bonding system by providing increased stiffness and reduced flexibility compared to direct substrate bonding. This parameter change allows for better control of substrate positioning and reduces distortion during the bonding process, achieving sub-100 nm alignment accuracy.
2Manufacturing precision
If the support plate is made stiffer to reduce run-out errors, then alignment accuracy improves, but the plate becomes less flexible and harder to conform to substrate variations
Solution Approach 1:
The support plate exhibits different mechanical properties at different locations and interfaces. The first surface contacting the substrate is designed with specific flexibility characteristics, while the second surface provides the stiff bonding interface. This local differentiation allows the plate to simultaneously reduce run-out errors and adapt to substrate variations.
Solution Approach 2:
The support plate can be constructed from composite materials or have composite structure that combines stiffness for run-out error reduction with controlled flexibility for substrate conformation. This composite approach resolves the contradiction between needing rigidity for precision and flexibility for adaptation.
Data Source
Figure 1
Figure 2a~2c
Figure 2d~2e
AI summary
The present invention relates to a method for bonding a first substrate (4o) to a second substrate (4u) at mutually facing contact surfaces (4k) of the substrates (4o, 4u), wherein the first substrate (4o) is received on a first receiving device (1o) and the second substrate (4u) is received on a second receiving device (1u), and wherein a plate (17u) is arranged between the second substrate (4u) and the second receiving device (1u), wherein the second substrate (4u) is deformed relative to the second receiving device (1u) with the plate (4u) before and/or during bonding. The present invention further relates to a corresponding device and a corresponding plate.