Curved Ply Guide for Curved Substrate Placement
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Solution Overview
Problem
Existing vacuum-assisted ply placement methods are ineffective for curved substrates due to difficulties in maintaining a vacuum and preventing wrinkling or bridging of plies during the layup process.
Innovation Solution
A method and apparatus utilizing a curved guide edge and guide surface that conform to the substrate's curvature, combined with a vacuum manifold to draw the ply down onto the substrate, ensuring a gas-impermeable interface and reducing air pressure to prevent wrinkling and bridging, with adjustable features for accommodating different substrate shapes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a vacuum assisted ply placement shoe with straight edge seals is used, then wrinkling and bridging are eliminated on flat substrates, but the vacuum cannot be maintained on curved substrates and wrinkling/bridging still occurs
Solution Approach 1:
The patent applies curved guide edges and curved seals instead of straight edges to match the substrate's curvature. The curved guide edge (32) and curved seal (41) conform to the substrate's curved surface, enabling the vacuum system to maintain its seal on curved geometries while preventing ply wrinkling and bridging.
Solution Approach 2:
The patent employs an adjustable guide edge curvature mechanism that can be modified to match different substrate curvatures. This dynamic adjustment capability allows the same vacuum placement system to adapt to various substrate geometries (different radii of curvature) while maintaining effective vacuum seals and ply placement precision.
2Manufacturing precision
If hand layup with sweeping is used, then wrinkling and bridging can be reduced, but manufacturing flow rate is low and rework is required
Solution Approach 1:
The patent replaces manual hand layup and sweeping operations with an automated vacuum-assisted placement system. The vacuum manifold (38) and vacuum source (45) create a mechanical suction force that draws the ply onto the substrate, eliminating the need for manual sweeping and significantly increasing manufacturing flow rate while maintaining placement quality.
Solution Approach 2:
The vacuum system automatically performs the ply placement function without requiring manual intervention. The vacuum pressure differential automatically draws the ply onto the substrate and maintains it in place, replacing the manual sweeping and reapplication processes with an autonomous mechanical system.
3Device complexity
If the ply is fed across a straight edge seal onto a curved substrate, then the seal is simple, but the ply wrinkles and bridges due to curvature mismatch
Solution Approach 1:
The patent replaces the straight edge seal with a curved seal (41) that matches the substrate's curvature. This curved seal design allows the ply to transition smoothly from its planar state to the curved substrate surface without wrinkles or bridges, while the seal remains effectively simple in its vacuum sealing function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables accurate and efficient placement of plies on curved substrates without wrinkling or bridging, improving manufacturing flow rates and reducing rework by maintaining a consistent vacuum seal across varying substrate geometries.
Implementation Method 1
a vacuum manifold adapted to be coupled with a vacuum source for drawing the ply down onto the substrate
Implementation Method 2
reducing air pressure beneath the ply
Data Source
AI summary
A ply placement device uses a ply guide to place plies on a curved substrate surface. The ply guide includes a guide surface and a guide edge that are each curved to match the contour of the substrate so that the ply transitions smoothly from its planar form to a curved form as the ply is placed onto the substrate. The ply guide may be flexible or segmented to allow reconfiguration of the guide surfaces to match various substrate contours.