Curved Ribbed Heat Spreader for Uniform Chip Contact Pressure
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Solution Overview
Problem
Traditional heat distribution devices are ineffective for larger microelectronic chips due to increased curvature, making it difficult to achieve uniform contact pressure and efficient thermal management, especially for chips larger than 2.5 inches on one side.
Innovation Solution
A heat distribution device with a recessed cavity and concentrically arranged ribs that form a non-planar surface, including a vent aperture, which allows for a thermal interface material to be distributed radially and tangentially, enhancing contact pressure and thermal conductivity across the chip surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional heat distribution devices are used for larger microelectronic chips, then the device structure remains simple, but uniform contact pressure and efficient thermal management cannot be achieved due to increased chip curvature
Solution Approach 1:
The heat distribution device incorporates a non-planar surface with radial curvature that matches the convex curvature of large microelectronic chips. This curved surface design allows the device to conform to the chip's geometry, ensuring uniform contact pressure distribution across the entire chip surface, thereby resolving the contradiction between maintaining simple structure and achieving precise contact pressure uniformity.
Solution Approach 2:
The device features a non-planar surface with varying local curvature radii designed to match specific regions of the chip. By adjusting the local surface properties (curvature) to correspond to the chip's geometry, the device achieves optimal contact pressure distribution across different areas, particularly addressing the challenge of maintaining uniform pressure on large chips with significant curvature variations.
2Adaptability or versatility
If chips with large surface areas and complex shapes are used, then functional requirements are met, but uniform thermal management becomes difficult due to increased curvature
Solution Approach 1:
The heat distribution device employs a non-planar surface with radial curvature specifically designed to match the convex curvature of large microelectronic chips. This curvature matching enables the device to accommodate chips with large surface areas and complex shapes while maintaining precise and uniform thermal contact across the entire interface, thereby simultaneously achieving adaptability and thermal management precision.
Solution Approach 2:
The device utilizes controlled variations in surface curvature parameters (radius of curvature) across different regions to adapt to chips of varying sizes and shapes. By adjusting these geometric parameters, the device maintains optimal contact uniformity for diverse chip configurations, resolving the contradiction between versatility and manufacturing precision.
3Reliability
If thermal interface material is applied to achieve thermal conductivity, then heat transfer is improved, but uneven distribution occurs on curved chip surfaces
Solution Approach 1:
The non-planar surface with radial curvature of the heat distribution device provides a geometry that facilitates uniform thermal interface material distribution. The curved surface design allows the material to spread evenly across the chip interface, ensuring consistent thermal conductivity throughout the contact area, thereby resolving the contradiction between achieving reliable heat transfer and maintaining uniform material distribution.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides increased and controlled contact pressure between the chip and the thermal interface material, improving thermal management and heat dissipation, even for chips with complex shapes and large surface areas, by compensating for curvature and ensuring optimal heat distribution.
Implementation Method 1
A thermal interface material is disposed within the channels and between the semiconductor chip and a surface of the recessed cavity
Data Source
AI summary
A heat distribution device comprising a main body, a recessed cavity positioned within the main body, the recessed cavity having an interior surface, a peripheral wall extending around and defining the interior surface, and a central point within the recessed cavity. A plurality of ribs may extend away from the interior surface of the recessed cavity. The plurality of ribs may be concentrically arranged around the central point and define a plurality of channels therebetween. Each of the plurality of ribs may have a top surface that slopes toward or away from the central point. The plurality of ribs may be arranged so that the top surfaces of the plurality of ribs collectively form a collective sloped surface within the heat distribution device.