Curved Semiconductor Die via Through-Die Cut Lines
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Solution Overview
Problem
Current optical systems face limitations in design and performance due to the use of flat photonic sensor dies, which restrict curvature and lead to constraints such as chromatic and spatial aberrations, and inefficiencies in light intensity and frequency response.
Innovation Solution
The technique involves bending semiconductor dies into curved shapes, such as spherical or aspheric forms, using in-plane strain and through-die cut lines to relieve stress and allow for higher curvature, enabling the photonic sensor dies to have a light-sensitive surface that can slide on a concave mold, reducing tension and increasing deflection capabilities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Shape
If flat photonic sensor dies are used, then manufacturing is simpler, but curvature is limited and optical performance deteriorates
Solution Approach 1:
The semiconductor die is divided into multiple segments by cutting slits that extend from the edge toward the center. These slits partition the die into regions that can independently deform, allowing the overall structure to achieve higher curvature without excessive stress accumulation in any single continuous region.
Solution Approach 2:
The semiconductor die is transformed from a rigid flat structure into a flexible membrane-like structure through the introduction of cutting slits. This enables the die to conform to curved surfaces and achieve the desired spherical or aspheric shape while maintaining structural integrity.
2Shape
If through-die cut lines are added to relieve stress, then curvature capability improves, but die strength decreases
Solution Approach 1:
The cutting slits extend only partially from the edge toward the center of the die, stopping before reaching the center radius. This partial cutting provides sufficient stress relief to enable the desired curvature while maintaining enough continuous material to preserve die strength and structural integrity.
Solution Approach 2:
The cutting slits are strategically positioned and sized to provide stress relief specifically in regions where curvature is needed, while leaving other regions intact to maintain strength. The local modification of the die structure allows differential properties across the die surface.
3Shape
If edges are rigidly constrained during bending, then positioning is more precise, but tension increases and curvature is limited
Solution Approach 1:
The edges of the semiconductor die are made dynamically movable rather than statically fixed during the bending process. The cutting slits allow the edges to slide and adjust their position as the die conforms to the curved mold surface, enabling stress-free deformation and higher achievable curvature.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the performance of optical systems by allowing for greater curvature and reduced stress, resulting in improved light intensity and spatial frequency response across the photonic sensor die, leading to more efficient and uniform light distribution.
Implementation Method 1
a curved semiconductor die, which includes relatively few and small die cuts, is subjected to in-plane strain to allow for relatively high die curvature
Implementation Method 2
The semiconductor die can include through-die cut lines that can lead to substantially less tension in the semiconductor die as compared to the case where the semiconductor die does not include through-die cut lines
Implementation Method 3
The edges or corners are able to move or slide on the surface of the concave mold as the semiconductor die is bent into the shape of the concave mold
Data Source
AI summary
Techniques for fabricating a semiconductor die having a curved surface can include placing a substantially flat semiconductor die in a recess surface of a concave mold such that corners or edges of the semiconductor die are unconstrained or are the only portions of the semiconductor die in physical contact with the concave mold. The semiconductor die can include through-die cut lines that can lead to substantially less tension in the semiconductor die as compared to the case where the semiconductor die does not include through-die cut lines. Accordingly, such through-die cut lines can allow for achieving relatively large curvatures.