Curved SiC Attraction Plate for Uniform Substrate Temperature Control
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Solution Overview
Problem
Existing substrate processing apparatuses for semiconductor manufacturing face challenges in efficiently and uniformly processing substrates with varying curvatures and thermal conductivity, as they rely on indirect heating methods that may not provide consistent temperature control across the substrate surface.
Innovation Solution
A substrate processing apparatus featuring a rotary table with a curved attraction plate made of high thermal conductivity material, such as SiC, that securely contacts the substrate and a hot plate, allowing for direct suction and thermal conduction, enabling precise temperature control and uniform processing through independent heating zones and suction/purge mechanisms.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If indirect heating methods are used to process substrates, then the apparatus can handle various substrate types, but the temperature control consistency across the substrate surface deteriorates
Solution Approach 1:
The patent introduces a susceptor as an intermediary component between the heating source and the substrate. The susceptor has high thermal conductivity and directly contacts the substrate, serving as a mediator that efficiently transfers heat uniformly across the substrate surface while allowing the apparatus to accommodate different substrate types through the flexible susceptor design
Solution Approach 2:
The patent changes the thermal conductivity parameter of the heating system by using a susceptor material with high thermal conductivity (such as graphite or metal materials) instead of conventional low thermal conductivity heating methods. This parameter change enables uniform heat distribution across the substrate surface while maintaining versatility in handling different substrate types
2Device complexity
If conventional heating methods are used, then the apparatus structure can be simple, but the thermal conduction losses increase
Solution Approach 1:
The susceptor acts as an intermediary that improves thermal conduction efficiency. By placing a high thermal conductivity material between the heating source and substrate, the system reduces thermal conduction losses without significantly increasing apparatus complexity, as the susceptor can be integrated into the existing substrate handling mechanism
Solution Approach 2:
The patent employs composite material structures where the susceptor may combine different materials (such as graphite coatings on metal substrates or layered composite structures) to optimize both thermal conductivity and mechanical properties, reducing energy losses while maintaining structural simplicity and compatibility with conventional apparatus designs
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration ensures efficient and uniform chemical liquid processing across the substrate, accommodating substrates with different curvatures and improving thermal conductivity for consistent temperature distribution, enhancing processing efficiency and reducing thermal conduction losses.
Implementation Method 1
a suction device configured to act a suction force on the at least one suction hole of the base plate, configured to firmly contact the base plate with the attraction plate by acting the suction force between the base plate and the attraction plate, and configured to firmly contact the attraction plate with the substrate by acting the suction force between the attraction plate and the substrate through the at least one through hole
Implementation Method 2
a rotation driving device configured to rotate the rotary table around a rotation axis
Data Source
AI summary
A substrate processing apparatus includes a rotary table comprising a base plate having a front surface where at least one suction hole is provided and an attraction plate having a front surface contacted with a non-processing surface of a substrate to attract the substrate, a rear surface contacted with the front surface of the base plate, and at least one through hole through which the front surface and the rear surface are connected; a rotation driving device configured to rotate the rotary table around a rotation axis; and a suction device configured to act a suction force on the suction hole, to contact the base plate with the attraction plate by acting the suction force between the base plate and the attraction plate, and to firmly contact the attraction plate with the substrate by acting the suction force between the attraction plate and the substrate through the through hole.