Curved Sputtering Target Layout for Uniform Thin-Film Deposition
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Solution Overview
Problem
Existing sputtering technologies struggle to form high-quality, undamaged thin films with uniform deposition density during the fabrication of display devices.
Innovation Solution
A sputtering device design featuring a substrate transferring unit, a back plate with specific angled portions and magnets, and a target with curved surfaces, which allows for precise control of plasma generation and target particle deposition, ensuring uniform film formation across the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional sputtering methods are used, then thin films can be formed, but the deposition density is insufficient and film quality is compromised
Solution Approach 1:
The back plate is designed with a curved surface having a specific radius of curvature, and the target surface is also curved to match. This curvature configuration focuses the sputtered particles onto a focal point on the substrate, creating a deposition focal point that concentrates material flux and achieves high deposition density while maintaining uniform film quality across the substrate surface.
Solution Approach 2:
The invention optimizes geometric parameters including the radius of curvature of the back plate, the angle of inclination of the target, and the distance between target and substrate. By carefully adjusting these parameters, the device achieves maximum deposition density at the focal point while ensuring uniform film formation across the entire substrate, resolving the contradiction between localized density and overall film quality.
2Manufacturing precision
If the target surface is flat, then manufacturing is simpler, but deposition uniformity across the substrate is poor
Solution Approach 1:
Both the target surface and back plate are designed with curved geometries that work together to focus sputtered particles. The curved target surface ensures uniform particle ejection angles, while the curved back plate focuses these particles onto a focal point on the substrate, achieving superior deposition uniformity across the entire substrate area.
3Manufacturing precision
If magnets are stationary, then device structure is simpler, but plasma generation control is insufficient for high-quality film formation
Solution Approach 1:
The magnet system is designed to be movable rather than stationary, allowing dynamic adjustment of the magnetic field position and intensity. This enables precise control of plasma generation and particle acceleration, ensuring optimal conditions for high-quality film formation while maintaining reasonable device complexity through controlled motion rather than complex multi-component systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device achieves high deposition density and uniform film formation, enhancing the quality and integrity of thin films in display devices.
Implementation Method 1
generating plasma at relatively low pressure, accelerating a gas such as an argon gas, and colliding the gas with a target to eject molecules
Implementation Method 2
Sputtering is a type of vacuum deposition that forms a thin film on a substrate in the vicinity by generating plasma at relatively low pressure, accelerating a gas such as an argon gas, and colliding the gas with a target to eject molecules
Implementation Method 3
a sputtering device capable of forming a thin film with a high deposition density
Data Source
AI summary
A sputtering device includes a substrate transferring unit which moves a substrate, a back plate disposed above the substrate transferring unit and supporting a target, and a magnet disposed on a second surface of the back plate which is opposite to a first surface of the back plate facing the substrate transferring unit, where the back plate includes a first portion and a second portion, which is bent from the first portion at a first angle.