Curved Stop Plate Positioning Power Semiconductors
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Solution Overview
Problem
Existing methods for positioning power semiconductors in converter systems often result in damage to the contact surfaces and require significant effort and stroke for assembly and maintenance, compromising operational safety and efficiency.
Innovation Solution
A device with a stop plate or dowel pins is used to precisely position power semiconductors, allowing for full-area contact and minimizing the assembly stroke, thereby preventing surface damage and simplifying the attachment process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If centering pins are used to position the power semiconductor, then positioning precision is improved, but the contact surface of the power semiconductor may be damaged
Solution Approach 1:
The patent introduces a receiving edge as an intermediary element between the centering pin and the power semiconductor contact surface. The receiving edge is designed with a curvature radius that is larger than the centering pin radius, allowing the power semiconductor to be guided onto the receiving edge without direct contact between the centering pin and the contact surface, thus preventing damage while maintaining positioning precision
Solution Approach 2:
The patent applies curvature by designing the receiving edge with a specific curvature radius (R2) that is larger than the centering pin radius (R1). This curved geometry allows smooth guidance of the power semiconductor during positioning, distributing contact forces and avoiding concentrated stress that could damage the contact surface
2Ease of operation
If the power semiconductor is lifted off the receiving body for positioning, then positioning can be performed, but assembly stroke increases and stability decreases
Solution Approach 1:
The patent designs the receiving edge to be substantially coplanar with the contact surface of the receiving body, creating an equipotential surface in terms of height. This allows the power semiconductor to be positioned and inserted in a substantially horizontal movement without lifting, eliminating the need for vertical displacement and reducing assembly stroke
3Manufacturing precision
If centering pins force the power semiconductor to be lifted, then positioning is achieved, but operational safety is reduced due to potential damage
Solution Approach 1:
The receiving edge serves as a protective intermediary that prevents direct contact between the centering pin and the power semiconductor contact surface. This intermediary structure maintains positioning accuracy while eliminating the harmful effect of pin-induced damage, thereby improving operational safety and reliability
Solution Approach 2:
The receiving edge is designed in advance to provide a cushioning effect during the positioning process. By having this protective structure pre-positioned on the receiving body, the system prevents damage before it can occur, ensuring both positioning precision and operational safety
Data Source
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AI summary
The device has a positioning device i.e. stop plate (80) arranged on receiving bodies (16, 18) i.e. cooling bodies, for receiving an edge area (78) of power semiconductors (12, 14) such that a movement of the power semiconductor is limited in a region of inner angles (59, 69) with contact of surfaces (52, 62) of the receiving bodies and a contact surface (74) of the power semiconductor. The inner angle is greater than 90 degrees and less than 180 degrees. The positioning device has a curved edge (82) that receives edge region of the semiconductor.