Curved Substrate Bonding Holders for Precise Alignment

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Solution Overview

Problem

Existing substrate bonding methods fail to account for substrate curvature, leading to significant positional misalignment between bonded substrates due to uniform pressing at the center, which varies with the curved state of the substrate.

Innovation Solution

A substrate bonding apparatus and method that uses substrate holders with adjustable vent channels and protruding members to account for local curvature, allowing precise alignment and controlled deformation of substrates before bonding, minimizing positional misalignment.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If the center portion of one substrate is pressed under the same condition regardless of curved state, then the bonding process is simple, but positional misalignment occurs between substrates

Engineering Contradiction:

Improvebonding process simplicityVSAvoidpositional alignment accuracy

Core Design Contradiction:

Ease of manufactureVSManufacturing precision

Solution Approach 1:

The substrate holder is designed with a curved surface that matches the curved state of the substrate, creating local adaptation rather than uniform contact. This allows different regions of the substrate to be held according to their specific curvature characteristics, preventing positional misalignment during bonding while maintaining process simplicity.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The curvature radius of the substrate holder is adjusted to match the curvature state of the substrate. By changing the geometric parameter (curvature radius) of the holder to correspond to the substrate's curved state, the system achieves precise positioning without complex adjustment mechanisms, resolving the contradiction between simplicity and precision.

Inventive Principle:

Principle #35Parameter changes

2Productivity

If the substrate is deformed into a centrally convex shape, then bonding can proceed, but the amount of positional misalignment varies largely depending on curved state

Engineering Contradiction:

Improvebonding process continuityVSAvoidpositional alignment consistency

Core Design Contradiction:

ProductivityVSManufacturing precision

Solution Approach 1:

The substrate holder is pre-configured with a curved surface that matches the expected curved state of the substrate before bonding begins. This preliminary adaptation prevents positional misalignment from varying during the bonding process, ensuring consistent alignment while maintaining continuous productivity without requiring real-time adjustments.

Inventive Principle:

Principle #10Preliminary action

3Device complexity

If a flat holding surface is used, then the device structure is simple, but magnification distortion occurs due to air resistance during substrate release

Engineering Contradiction:

Improveholding surface structureVSAvoidsubstrate alignment accuracy

Core Design Contradiction:

Device complexityVSManufacturing precision

Solution Approach 1:

The holding surface is changed from flat to curved, matching the natural curved state of the substrate. This curvature eliminates magnification distortion caused by air resistance during substrate release, as the curved surface allows air to flow more evenly around the substrate edges, maintaining alignment accuracy without significantly increasing structural complexity.

Inventive Principle:

Principle #14Spheroidality (Curvature)

Data Source

PatentUS12598939B2Substrate bonding device, calculation device, substrate bonding method, and calculation method

Publication Date: 2026.04.07 SCREEN HOLDINGS CO LTD

AI summary

Provided is a substrate bonding apparatus comprising: a first holding unit for holding a first substrate; and a second holding unit for holding a second substrate, wherein the substrate bonding apparatus is configured to bond the first substrate and the second substrate by, after forming a contact region between a part of the first substrate and a part of the second substrate, expanding the contact region to form an initially bonded region and releasing the second substrate having the initially bonded region formed thereon from the second holding unit.