Curved Package Substrate Routing for Die Corner Crack Resistance
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Solution Overview
Problem
Existing semiconductor package structures are prone to conductive line cracks due to stress concentration at the die corner areas during thermal processes, leading to reliability issues.
Innovation Solution
Implementing non-linear or curved conductive lines in the stress concentration areas under the semiconductor die to disperse stress and prevent crack formation, using a method that includes forming a package substrate with redistribution layers and routing conductive lines in a zig-zag or curved pattern to avoid stress concentration at intersections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional linear conductive lines are used in package substrate, then manufacturing is simple, but stress concentration occurs at die corner areas during thermal processes causing conductive line cracks
Solution Approach 1:
The patent applies curvature to conductive lines by routing them in zig-zag or curved patterns instead of straight lines. This curvature design allows the conductive lines to better accommodate thermal expansion and stress during thermal processes, preventing stress concentration and crack formation at die corner areas while maintaining manufacturing feasibility through standard photolithography processes.
2Reliability
If conductive lines are routed in zig-zag or curved patterns to disperse stress, then crack resistance improves, but manufacturing precision requirements increase
Solution Approach 1:
The patent segments the conductive lines into multiple sections connected at angles (zig-zag pattern) or smooth curves. This segmentation distributes the stress along multiple segments rather than concentrating it in a single linear path. The segmented design can be implemented using standard multi-layer PCB routing techniques and photolithography processes, balancing stress distribution with manufacturing precision requirements.
Data Source
AI summary
A semiconductor die package is provided. The semiconductor die package includes a semiconductor die and a package substrate supporting and electrically connected to the semiconductor die through conductive connectors. The package substrate includes a plurality of conductive lines and has a stress concentration area under the semiconductor die. One of the conductive lines within the stress concentration area includes a first line segment and a second line segment connected to the first line segment. The first line segment is linear and extends in a first direction. The second line segment is curved.