Curved Substrate Bonding to Minimize Edge Run-Out Errors
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Solution Overview
Problem
The challenge in the semiconductor industry is achieving precise alignment and bonding of substrates with minimal 'run-out' errors, particularly at the edges, due to changes in substrate alignment during the bonding process, which results in high costs, low throughput, and susceptibility to errors.
Innovation Solution
The method involves curving both substrates before bonding and controlling the curvature during the bonding process using forces like gravity and attraction, with monitoring and control of curvature changes to ensure precise, sequential contacting of the substrates, minimizing 'run-out' errors by maintaining similar radii of curvature between the substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional flat substrate bonding is used, then the bonding process is simple, but alignment accuracy deteriorates at the substrate edges due to run-out errors
Solution Approach 1:
The patent applies curvature to substrate holders during the bonding process. By curving the substrate holders in a controlled manner, the substrates maintain consistent alignment accuracy across their entire surface, including edges. This curvature compensation technique counteracts the run-out errors that occur during bonding, ensuring uniform bonding quality without requiring complex additional alignment mechanisms.
2Manufacturing precision
If substrate alignment is corrected after bonding, then alignment accuracy can be improved, but production throughput decreases and costs increase
Solution Approach 1:
The patent implements preliminary curvature adjustment of substrate holders before the bonding process begins. By pre-configuring the holders with appropriate curvature, the system prevents run-out errors from occurring during bonding, eliminating the need for post-bonding alignment corrections. This preliminary action maintains high production throughput while ensuring alignment accuracy.
3Manufacturing precision
If substrate curvature is controlled during bonding, then bonding accuracy is improved, but process complexity increases
Solution Approach 1:
The patent employs dynamic curvature control of substrate holders during the bonding process. The curvature is adjusted in real-time based on the bonding stage and substrate characteristics. This dynamic adaptation allows the system to maintain optimal alignment accuracy throughout bonding while using a relatively simple control mechanism that responds to process conditions rather than requiring complex pre-programming.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for optimal bonding with minimized 'run-out' errors, ensuring accurate alignment and reducing the likelihood of errors and costs associated with substrate bonding, while maintaining high throughput.
Implementation Method 1
The automatic contacting takes place in particular through the force of gravity acting on the substrate and/or other forces of attraction between the substrates
Implementation Method 2
The automatic contacting takes place in particular through the force of gravity acting on the substrate and/or other forces of attraction between the substrates
Data Source
AI summary
A method and a corresponding device for bonding a first substrate with a second substrate at mutually facing contact faces of the substrates. The method includes holding of the first substrate to a first holding surface of a first holding device and holding of the second substrate to a second holding surface of a second holding device. A change in curvature of the contact face of the first substrate and/or a change in curvature of the contact face of the second substrate are controlled during the bonding.