Curved Surface Electronic Apparatus Using Segmented Substrate
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Solution Overview
Problem
Electronic devices with a Gaussian curvature of 0 cannot be transformed into a 3D shape with positive or negative curvature without generating crinkles or folding, leading to potential breakage due to applied stress.
Innovation Solution
The method involves approximating a 3D structure's surface with 2D meshes, developing these meshes into a 2D plane, manufacturing an electronic apparatus with the same shape, and attaching it to the 3D structure, using a substrate with branches that connect and separate to maintain contact without bending.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If an electronic apparatus with Gaussian curvature of 0 is transformed into a 3D shape with positive or negative Gaussian curvature, then the electronic apparatus can be attached to a curved surface, but crinkles, bending, or folding are inevitably generated due to applied stress
Solution Approach 1:
The substrate is divided into multiple rigid branches that are connected through flexible connection portions. Each branch maintains its rigid structure while the connection portions allow relative movement and deformation, enabling the overall structure to adapt to curved surfaces without generating crinkles or folding in the rigid branches.
Solution Approach 2:
The connection portions between branches are designed to be flexible and deformable, allowing dynamic adjustment of the substrate's shape. This dynamic characteristic enables the rigid branches to remain stress-free while the connection portions absorb the deformation required to match curved surfaces.
2Ease of manufacture
If an electronic apparatus is manufactured in a flat state, then manufacturing is simplified, but the apparatus cannot maintain close contact with a curved surface
Solution Approach 1:
The substrate is segmented into multiple rigid branches connected by flexible portions. This segmentation allows each branch to be manufactured as a simple rigid structure using conventional flat manufacturing processes, while the flexible connection portions enable the overall structure to conform to curved surfaces when deployed.
Solution Approach 2:
The connection portions are designed as flexible structures that can deform to bridge the rigid branches. These flexible portions act as adaptive elements that enable surface conformity without requiring complex curved manufacturing processes, thus maintaining ease of manufacture while achieving surface conformity.
3Reliability
If the electronic apparatus is made rigid to maintain structural integrity, then reliability improves, but the apparatus cannot deform to match curved surfaces
Solution Approach 1:
The substrate is divided into rigid branches (providing structural integrity) and flexible connection portions (providing deformability). This segmentation allows the rigid branches to maintain their shape and protect electronic devices, while the flexible connections enable the overall structure to deform and adapt to curved surfaces.
Solution Approach 2:
Different portions of the substrate have different mechanical properties: the branches are rigid to maintain structural integrity and protect electronic devices, while the connection portions are flexible to enable deformation. This local differentiation of mechanical properties allows simultaneous achievement of reliability and adaptability.
4Shape
If the electronic apparatus deforms to match a curved surface, then surface contact is improved, but stress is applied to the apparatus causing potential breakage
Solution Approach 1:
The substrate is segmented into rigid branches and flexible connection portions. When the apparatus deforms to match a curved surface, the flexible connection portions bear the deformation stress while the rigid branches remain relatively stress-free, preventing breakage of the electronic devices mounted on the branches.
Solution Approach 2:
The flexible connection portions act as intermediaries between the rigid branches and the curved surface. These connection portions absorb the stress of deformation and protect the rigid branches and mounted electronic devices from direct stress exposure, thereby maintaining strength while achieving surface contact.
Data Source
AI summary
Provided is a method of manufacturing an electronic apparatus, the method including approximating a surface of a three-dimensional (3D) structure with two-dimensional (2D) meshes, forming a developed view by developing the 2D meshes, manufacturing an electronic apparatus having the same shape as a shape of the developed view, and attaching the electronic apparatus to the surface of the 3D structure.


