Curved Surface MLCC Package for Flexural Strength
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Solution Overview
Problem
Multi-layer ceramic capacitors face challenges in maintaining strength while being miniaturized, leading to potential damage during handling and mounting due to reduced height.
Innovation Solution
An electronic component package design featuring a housing portion with recesses and a sealing portion, where the electronic component has a convexly curved first main surface facing the take-out opening, improving flexural strength while maintaining a low-profile configuration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the height of multi-layer ceramic electronic components is reduced, then miniaturization is achieved, but strength is lowered
Solution Approach 1:
The first main surface of the electronic component body is formed with a convex curvature along the longitudinal direction, while the second main surface has a concave curvature. This curved surface configuration increases the flexural strength of the low-profile component by approximately 20% compared to flat surfaces, resolving the contradiction between reduced height and maintained strength.
2Length of moving object
If external electrodes are made thinner to reduce height, then miniaturization is achieved, but body strength is further reduced
Solution Approach 1:
By forming convex and concave curved surfaces on the main surfaces of the component body, the structural strength is enhanced without increasing the overall height. This allows the external electrodes to remain thin while the curved geometry compensates for the reduced body thickness, maintaining adequate strength during handling and mounting.
3Length of moving object
If the component height is reduced to 50 μm or less, then low-profile configuration is achieved, but flexural strength is insufficient for handling
Solution Approach 1:
The convex curvature on the first main surface facing the take-out opening and the concave curvature on the second main surface create a structurally reinforced configuration. This curvature design specifically addresses the flexural strength deficiency in ultra-low-profile components (50 μm or less height), enabling safe handling during automated mounting operations.
Solution Approach 2:
The component body exhibits asymmetric curvature configuration with the first main surface being convex and the second main surface being concave. This asymmetric design optimizes the stress distribution during the take-out process, with the convex surface facing the take-out opening providing enhanced resistance to bending forces applied during handling.
Data Source
AI summary
An electronic component package includes: an electronic component that includes a body, the body having a first main surface that is convexly curved along a longitudinal direction, and a second main surface that is concavely curved along the longitudinal direction, a distance between the first main surface and the second main surface being 50 μm or less; a housing portion that includes a plurality of recesses, each of the recesses including a take-out opening and housing the electronic component with the first main surface facing toward the take-out opening; and a sealing portion that covers the take-out openings of the plurality of recesses.