Curved Test Socket Assembly for IC Device Profile Conformance
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Solution Overview
Problem
Conventional device testers deform IC devices due to undue pressure, especially on curved substrates, leading to uneven and flattened surfaces during testing, which is exacerbated by the assumption that devices are flat, causing permanent deformation in thinner substrates used in portable devices.
Innovation Solution
A thermal control unit with a test socket assembly that conforms to the IC device's profile, using a pedestal assembly with a heat-conductive pedestal, temperature-control fluid circulation, and a controllable force distributor to maintain a set point temperature and distribute forces evenly across the device, preventing deformation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional device testers with flat pedestals and pushers are used, then testing can be performed on IC devices, but undue pressure is exerted on curved devices causing deformation and flattening of the substrate surface
Solution Approach 1:
The pedestal and substrate pusher are designed with curved surfaces that conform to the natural curvature of IC devices. The pedestal includes a curved contact surface that matches the device profile, and the substrate pusher has a curved lower surface that follows the substrate's natural arc, eliminating undue pressure points and preventing deformation during testing
Solution Approach 2:
Different portions of the testing apparatus have different curvature radii matched to specific regions of the IC device. The pedestal curvature matches the device body profile while the substrate pusher curvature matches the substrate profile, allowing each component to locally adapt to the device geometry and distribute pressure evenly
2Measurement precision
If elevated pressure is applied during testing to ensure contact, then electrical contact is improved, but the device surface becomes permanently deformed and flattened
Solution Approach 1:
The curved surfaces of the pedestal and substrate pusher distribute contact pressure along the natural curvature of the device, maintaining consistent electrical contact without concentrating force at specific points that would cause permanent deformation
Solution Approach 2:
The contact pressure is distributed over a larger surface area through the curved geometry, effectively reducing the pressure intensity while maintaining total contact force, thereby achieving good electrical contact without exceeding the substrate's elastic limit
3Volume of moving object
If thin substrates are used in portable devices to reduce size, then device compactness is improved, but the substrates become more susceptible to deformation under testing pressure
Solution Approach 1:
The curved pedestals and pushers are specifically designed to accommodate thin substrates by distributing pressure along the substrate's natural curvature, preventing localized stress concentrations that would cause deformation in thin, less robust substrates
Solution Approach 2:
The curved geometry of the testing apparatus components acts as a protective cushion that distributes and softens the applied pressure before it reaches the thin substrate, preventing deformation before it can occur
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution minimizes deformation of IC devices during testing, ensuring accurate functionality and reducing losses due to physical damage or poor contact alignment during assembly, while maintaining the devices' original specifications.
Implementation Method 1
a heat-conductive pedestal configured to contact the die of the DUT
Implementation Method 2
temperature-control fluid circulation
Data Source
AI summary
A test socket assembly, useful in association with a thermal control unit (TCU) used to maintain a set point temperature on an IC device under test, has alignment holes with bushings that are secured within the alignment holes by using retaining pins. The retaining pins can be easily screwed in and out of the socket. This provision allows the bushings to be replaced easily as they get worn out or deformed from repeated testing.