Curved VCSEL Array Assembly for Flexible LiDAR Manufacturing
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Solution Overview
Problem
Conventional VCSELs are challenging to manufacture as 2-D arrays with curvature, particularly for applications like LiDAR, due to the limitations of GaAs substrates, and face difficulties in mass production and high transfer costs when directly transferring VCSELs to flexible substrates.
Innovation Solution
A VCSEL array and chip design that includes a substrate with an adhesive layer, a VCSEL chip, polymer coating, and interconnectors, featuring distributed Bragg reflector pairs, oxide layers, and mesa structures, allowing for self-assembly and transfer of VCSELs with customizable cross-sectional shapes and wavelengths, enabling curvature and efficient manufacturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If VCSELs are manufactured using conventional GaAs substrate methods, then mass production capability is improved, but the ability to achieve curvature and flexibility is worsened
Solution Approach 1:
The invention separates the VCSEL chip from the rigid GaAs substrate, allowing the VCSEL array to be transferred onto flexible substrates. This segmentation enables the optical components to be produced in bulk on suitable substrates while achieving curvature and flexibility through the flexible substrate platform, resolving the contradiction between mass production capability and adaptability.
Solution Approach 2:
The invention changes the substrate material parameter from rigid GaAs to flexible substrates, fundamentally altering the mechanical properties of the VCSEL array. This parameter change enables both mass production (through established flexible substrate manufacturing) and curvature/flexibility (through the inherent properties of flexible substrates), simultaneously addressing both requirements.
2Adaptability or versatility
If VCSELs are directly transferred to flexible substrates, then curvature and flexibility are improved, but manufacturing cost and process complexity are worsened
Solution Approach 1:
The invention performs preliminary actions by pre-assembling the VCSEL array on a temporary substrate with all necessary components (VCSEL chips, bonding pads, interconnectors) before the final transfer to the flexible substrate. This preliminary assembly simplifies the transfer process and reduces complexity by organizing all components in their final configuration beforehand, making the subsequent transfer more efficient and cost-effective.
Solution Approach 2:
The invention introduces an intermediary substrate that serves as a temporary platform for assembling the VCSEL array before transfer to the final flexible substrate. This intermediary substrate facilitates the manufacturing process by providing a stable platform for assembly while enabling eventual transfer to achieve curvature and flexibility, thereby reducing the complexity of direct transfer methods.
3Adaptability or versatility
If VCSEL arrays are designed with customizable cross-sectional shapes, then adaptability for various applications is improved, but manufacturing precision requirements are worsened
Solution Approach 1:
The invention applies local quality by enabling different regions of the VCSEL array to have different cross-sectional shapes and optical characteristics. Each VCSEL chip can be customized with specific shapes and wavelengths according to application requirements, while maintaining overall array integrity. This localized customization achieves high adaptability without requiring extreme manufacturing precision across the entire array.
Solution Approach 2:
The invention changes key parameters such as cross-sectional shape, wavelength, and size of individual VCSEL chips to meet specific application requirements. By adjusting these parameters during the design and manufacturing process, the system achieves high adaptability for various applications while using standard manufacturing tolerances, thereby avoiding the need for excessively high manufacturing precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the production of VCSEL arrays with customizable curvature and wavelengths, facilitating mass production and reducing transfer costs, while maintaining optical performance and flexibility for various applications.
Implementation Method 1
a first reflection part including a plurality of distributed Bragg reflector (DBR) pairs, a second reflection part including a plurality of DBR pairs
Implementation Method 2
an oxide layer disposed between the cavity layer and the first reflection part or the second reflection part and configured to determine characteristics of a laser to be output and the diameter of an opening
Implementation Method 3
an adhesive layer coated on the substrate, a VCSEL chip disposed on the adhesive layer and fixed to the adhesive layer
Data Source
AI summary
A vertical cavity surface emitting laser (VCSEL) chip, a VCSEL array, and a method of manufacturing the VCSEL array are disclosed. The VCSEL array includes a substrate, an adhesive layer coated on the substrate, a VCSEL chip disposed on the adhesive layer and fixed to the adhesive layer and configured to oscillate light or a laser by being supplied with power, a polymer coated on the VCSEL chip and the adhesive layer, and an interconnector electrically connected to the VCSEL chip.