Curved-Wire Touch Assembly for Low-Temperature Black Matrix Protection
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The manufacturing process of touch modules using indium tin oxide (ITO) as transparent electrodes faces issues of limited indium reserves, environmental pollution, high energy consumption, and waste management, along with problems like jump wires and damage to the black matrix layer during high-temperature laminating processes.
Innovation Solution
A touch assembly comprising a protective cover plate, first and second adhesive layers, and curved wires with conductive inner cores and covering layers, produced through winding technology, which uses enameled wires and specific adhesive layer thicknesses to prevent pollution and energy consumption, and addresses jump wires and black matrix damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If indium tin oxide (ITO) is used as transparent electrodes, then transparent electrode performance is achieved, but environmental pollution and high energy consumption occur during manufacturing
Solution Approach 1:
The patent replaces expensive and environmentally harmful ITO materials with cost-effective and eco-friendly alternative materials such as conductive polymers or metal grids that can be deposited at lower temperatures and without vacuum conditions, eliminating the need for harmful mining and processing of rare metals
Solution Approach 2:
The patent changes the manufacturing parameters from high-temperature vacuum deposition to low-temperature atmospheric deposition processes, fundamentally altering the production method to reduce energy consumption and environmental harm while maintaining electrode functionality
2Reliability
If high temperature, high pressure, vacuum deposition equipment is used, then ITO production is achieved, but high energy consumption occurs
Solution Approach 1:
The patent eliminates the need for expensive vacuum deposition equipment by using alternative material deposition methods that can be performed in atmospheric conditions, significantly reducing energy consumption while achieving comparable or superior electrode performance
Solution Approach 2:
The patent replaces complex mechanical vacuum deposition systems with simpler, lower-energy deposition methods such as spin coating, dip coating, or inkjet printing, substituting high-energy physical vapor deposition with lower-energy chemical or colloidal deposition processes
3Strength
If high temperature laminating process is used, then adhesive bonding is achieved, but black matrix layer damage occurs
Solution Approach 1:
The patent changes the laminating temperature parameter from high temperature to low temperature ranges, using temperature-sensitive adhesives that cure at reduced temperatures, thereby preventing thermal damage to the black matrix layer while maintaining adequate bond strength
Solution Approach 2:
The patent introduces a low-temperature curing adhesive formulation or intermediate layer that acts as a thermal buffer, allowing bonding to occur at temperatures below the damage threshold of the black matrix layer, thus protecting the sensitive underlying structures during assembly
4Productivity
If vast amount of ITO is wasted during manufacturing, then production volume increases, but waste management problems arise
Solution Approach 1:
The patent implements waste recovery strategies by designing deposition processes that minimize material loss, enabling reuse of conductive material solutions, and establishing collection systems for defective or excess materials that can be recycled into new electrodes, thereby reducing overall waste generation
Solution Approach 2:
The patent changes the deposition parameters to achieve higher material utilization efficiency, reducing waste through optimized coating thicknesses, improved deposition uniformity, and minimized material spillage or evaporation during the manufacturing process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents high pollution and energy consumption, reduces visual shadows, and protects the black matrix layer, enhancing the manufacturing process efficiency and reducing waste.
Implementation Method 1
The first adhesive layer and the second adhesive layer fill gaps within the first group of wires and gaps within the second group of wires
Implementation Method 2
Each of the plurality of curved wires comprises a conductive inner core and a covering layer
Data Source
AI summary
A touch assembly includes a protective cover, a first adhesive layer, a plurality of curved wires, and a second adhesive layer. The first adhesive layer is disposed on the protective cover. A thickness of the first adhesive layer ranges from 20 μm to 200 μm. An initial tack of the first adhesive layer ranges from 1800 gf/in to 4000 gf/in. The curved wires are disposed on the first adhesive layer and include a first group of wires and a second group of wires. The first group of wires extend along a first direction. The second group of wires extend along a second direction and overlap the first group of wires. Each of the curved wires includes a conductive inner core and a covering layer. The second adhesive layer covers the curved wires and the first adhesive layer.