Curved Wireless Chip Design for Safety and Recyclability
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing wireless chips used in automatic recognition techniques for object management and tracking pose safety risks due to their small size and lack of consumer awareness, and they are difficult to recycle effectively.
Innovation Solution
A wireless chip design featuring a dielectric layer with a high dielectric constant, a cylindrical or polygonal prism shape with curved surfaces, and a resin or DLC coating for safety and recyclability, ensuring the chip has only flat and curved surfaces with no corners to prevent injury and facilitate recognition and recycling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If wireless chips are made small in size for cost-effectiveness and communication efficiency, then manufacturing cost is reduced and communication property is improved, but consumer safety is compromised due to accidental ingestion or injury risks
Solution Approach 1:
The patent applies spheroidality by designing the wireless chip with a spherical shape having only curved surfaces and no corners. This curvature eliminates sharp edges that could cause injury, while the spherical form factor maintains compact size for cost-effectiveness. The rounded geometry directly addresses safety concerns while preserving the small form factor needed for economical manufacturing and efficient communication.
2Productivity
If wireless chips are made small and inexpensive for widespread use in automatic recognition systems, then productivity and ease of manufacture are improved, but recycling and disposal become difficult
Solution Approach 1:
The patent applies segmentation by designing the wireless chip as a modular structure with distinct functional layers including a dielectric layer, conductive layers forming the antenna, and semiconductor elements. This segmentation allows individual components to be separated and recycled independently, facilitating material recovery while maintaining manufacturing efficiency through standardized modular production processes.
Solution Approach 2:
The patent employs composite materials by constructing the wireless chip from multiple material layers including dielectric materials, conductive materials, and semiconductor materials. This composite structure enables selective recycling of different material types based on their properties, improving recyclability while maintaining the integrated design needed for cost-effective manufacturing and performance.
3Ease of manufacture
If wireless chips use conventional flat designs with corners, then manufacturing is simpler, but consumer safety is compromised due to potential injury from sharp edges
Solution Approach 1:
The patent applies spheroidality by replacing the conventional flat design with corners and edges with a spherical shape having only curved surfaces. This geometric transformation eliminates all sharp edges that could cause injury, while the spherical form can be manufactured using standard molding processes that maintain simplicity and cost-effectiveness.
4Object-affected harmful factors
If wireless chips are designed with curved surfaces only for safety, then consumer safety is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent applies parameter changes by specifying acceptable ranges for the spherical geometry parameters such as diameter and surface curvature radius, rather than requiring exact precision. This approach maintains safety benefits of the curved surface design while allowing manufacturing tolerances that reduce precision requirements and costs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances safety by preventing accidental ingestion or injury and allows for easy recognition and recycling, while maintaining effective communication properties and a compact size.
Implementation Method 1
The dielectric layer has a spherical shape, an ovoid shape, an oval spherical shape like a go stone, an oval spherical shape like a rugby ball, a disc shape, or has a cylindrical shape or a polygonal prism shape
Implementation Method 2
The antenna includes a first conductive layer, a second conductive layer, and a dielectric layer sandwiched between the first conductive layer and the second conductive layer
Implementation Method 3
The antenna and the layer including a semiconductor element are electrically connected through a resin layer containing conductive particles
Data Source
AI summary
The invention provides a wireless chip which can secure the safety of consumers while being small in size, favorable in communication property, and inexpensive, and the invention also provides an application thereof. Further, the invention provides a wireless chip which can be recycled after being used for managing the manufacture, circulation, and retail. A wireless chip includes a layer including a semiconductor element, and an antenna. The antenna includes a first conductive layer, a second conductive layer, and a dielectric layer sandwiched between the first conductive layer and the second conductive layer, and has a spherical shape, an ovoid shape, an oval spherical shape like a go stone, an oval spherical shape like a rugby ball, or a disc shape, or has a cylindrical shape or a polygonal prism shape in which an outer edge portion thereof has a curved surface.