Cushion-Based Housing Structure for Industrial Computer Aging Resistance
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Solution Overview
Problem
Industrial computer housings face challenges in passing aging, dust-proof, and explosion prevention tests due to weakened structural strength after aging tests, leading to dust ingress and failure in maintaining original appearance with traditional reinforcement methods.
Innovation Solution
A housing structure featuring a motherboard covered by first and second cushions, which are soft members made of heat-resistant materials, attached to casings with through holes for fixing members, providing dust prevention, explosion prevention, and shock absorption without reinforcing the casing strength or reducing the motherboard's current.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the structural strength of the housing is reinforced by increasing thickness or adding reinforcement designs, then the housing can better withstand aging tests, but the appearance of the housing is affected and cannot maintain its original appearance
Solution Approach 1:
The housing is divided into multiple components: a first cushion member covering the first surface of the motherboard, a second cushion member covering the second surface, and a connecting member joining these cushions. This segmentation allows each component to be optimized independently - the cushions provide structural reinforcement while remaining aesthetically pleasing, solving the contradiction between strength and appearance
Solution Approach 2:
The first and second cushion members act as intermediary elements between the motherboard and the external environment. These cushions absorb impact and provide structural support without requiring visible reinforcement designs on the housing exterior, thus maintaining original appearance while improving structural strength
2Strength
If the structural strength of the housing is reinforced to pass aging tests, then the housing may better resist impact, but most housings still fail to pass both aging tests and dust-proof tests
Solution Approach 1:
The first and second cushion members are installed on the motherboard before the aging test to provide pre-cushioning protection. This beforehand cushioning absorbs impact during aging tests and maintains the housing's structural integrity, enabling it to pass both aging tests and subsequent dust-proof tests
Solution Approach 2:
The cushion members are made of flexible cushioning material that can deform to absorb impact forces during aging tests. This flexibility allows the housing to withstand repeated impact without structural failure, significantly improving the test pass rate while maintaining dust-proof performance
3Temperature
If high-temperature processing and low-temperature processing are performed during aging tests, then the housing undergoes thermal stress, but the structural strength of the housing is greatly weakened making it difficult to pass dust-proof tests
Solution Approach 1:
The cushion members are installed before thermal aging processing to provide continuous protection. During high-temperature and low-temperature cycling, the cushions maintain the housing's structural integrity by absorbing thermal stress and preventing crack propagation, ensuring the housing retains sufficient strength to pass dust-proof tests after aging
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents dust ingress and achieves explosion-proof results without reinforcing the casing strength or reducing the motherboard's current, while maintaining the original appearance and enhancing shock absorption.
Implementation Method 1
a first cushion and a second cushion of the housing structure cover two opposite side faces of a motherboard
Implementation Method 2
the first cushion or the second cushion has a heat dissipation portion, the heat dissipation portion is in contact with the heating unit
Data Source
AI summary
The application discloses an electronic device including a motherboard and a housing structure. The motherboard has a first surface and a second surface. The housing structure includes a first casing, a first cushion, a second casing, and a second cushion. The first casing has at least one first fixing member. The first cushion covers the first surface, is accommodated in the first casing and has at least one first through hole. The second casing has at least one second fixing member. The second cushion covers the second surface, is accommodated in the second casing and has at least one second through hole. A peripheral edge of the first cushion is attached to a peripheral edge of the second cushion, and the first fixing member may be fixed to the second fixing member through the first through hole and the second through hole.