Custom Module Lid with Pockets for Thermal Interface
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Solution Overview
Problem
The increasing power density of computer chips and their integration in devices lead to challenges in packaging, particularly in maintaining uniform gaps between chip components and module lids, which existing technologies like small gap technology (SGT) and very thin thermal interface materials (TIM) fail to address effectively.
Innovation Solution
A method involving a custom module lid with customized pockets is developed, where a multichip module (MCM) is placed on a module base with a first thermal interface material, a temporary lid is used to measure the surface profile of target components, and a custom lid is fabricated with matching pockets to ensure precise fit and uniform thermal interface, allowing for improved thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If very thin thermal interface materials (TIM) are used to fill the gap between chips and module lids, then thermal conductivity is improved, but manufacturing precision deteriorates due to difficulty in maintaining uniform gaps
Solution Approach 1:
The patent applies local quality by creating custom pockets in the module lid with tailored geometries that match the specific surface profiles of individual chip components. Each pocket is locally adapted to accommodate variations in component topography, ensuring uniform TIM thickness and consistent thermal contact pressure across different regions of the module.
Solution Approach 2:
The patent implements preliminary action by measuring the surface profiles of chip components before manufacturing the module lid. These measurements are used to pre-calculate and pre-form the custom pocket geometries, eliminating the need for gap maintenance adjustments during assembly and ensuring precise thermal interface from the outset.
2Manufacturing precision
If custom module lids with tailored pockets are manufactured to match chip surface profiles, then manufacturing precision is improved, but device complexity increases
Solution Approach 1:
The patent replaces complex mechanical measurement and manual machining operations with optical or interferometric measurement systems and automated computer-controlled manufacturing processes. This substitution maintains high manufacturing precision for custom pocket fabrication while reducing operational complexity and improving repeatability.
Solution Approach 2:
The patent applies copying by creating accurate digital or physical replicas of chip component surface profiles through measurement systems. These copies are then used as templates to generate the corresponding pocket geometries in the module lid, ensuring precise fit without requiring complex iterative adjustment processes.
3Ease of manufacture
If standard flat module lids are used, then ease of manufacture is improved, but thermal interface efficiency deteriorates due to undesirable gaps between components and lid
Solution Approach 1:
The patent transitions from uniform flat lids to locally adapted custom pockets that match component surface profiles. This local customization ensures optimal thermal contact in each region while maintaining overall manufacturing feasibility through standardized processes applied to variable geometries.
Solution Approach 2:
The patent changes the geometric parameters of the module lid from fixed flat surfaces to variable pocket geometries defined by measured component profiles. This parameter adaptation optimizes thermal interface conditions while the underlying manufacturing process remains based on established techniques.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach ensures a uniform gap between chip components and the module lid, enhancing thermal interface efficiency and preventing undesirable gaps, thereby improving the thermal management and packaging of high-power density components.
Implementation Method 1
placing a first thermal interface material (TIM) in the base pocket, wherein the first TIM is on a bottom surface of the base pocket
Implementation Method 2
placing a second TIM in the custom pocket and in the standard pocket, wherein a portion of the second TIM is on a top surface of the custom pocket
Implementation Method 3
measuring a surface profile of the target component through the viewing window
Data Source
AI summary
A method of forming a custom module lid. The method may include placing a multichip module (MCM) between a module base and a temporary lid, target components are exposed through viewing windows in the temporary lid, a top surface of the target components is measured and mapped to create a target profile, the target profile is used to form custom pockets in a custom lid, and the custom pockets correspond to the target components.