Custom RDL Repair Layout for Semiconductor Defect Rerouting
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Solution Overview
Problem
Existing semiconductor devices face manufacturing defects such as shorts and opens in their redistribution layers (RDLs), which can lead to functional failures and increased production costs due to the need for scrap devices, as conventional RDLs lack the ability to be repaired or adapted during production.
Innovation Solution
A method for forming a repairable RDL design that involves inspecting initial conductive segments for defects and forming secondary segments to reroute around or mitigate these defects, using redundant traces to create a new custom RDL design that meets electrical constraints, allowing for real-time adaptation during semiconductor device production.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional RDL design is used, then manufacturing process is simple, but defects cause device failure and high scrap rates
Solution Approach 1:
The patent applies preliminary action by pre-forming redundant conductive segments and alternative routing paths during the initial RDL manufacturing process. These redundant structures are prepared in advance but remain dormant until defects are detected through inspection, at which point they are activated to bypass defective areas. This approach enables defect mitigation without requiring complex post-manufacturing modifications.
Solution Approach 2:
The patent employs parameter changes by dynamically modifying the RDL configuration based on detected defect parameters. When defects are identified, the system changes the electrical connectivity parameters by activating alternative conductive paths, adjusting routing topology, and reconfiguring signal flow. This allows the RDL to adapt its electrical characteristics to compensate for manufacturing variations and defects.
2Reliability
If inspection and repair processes are added, then defect mitigation is improved, but production time increases
Solution Approach 1:
The patent applies segmentation by dividing the RDL into multiple independent conductive segments, modules, and routing sections. This segmentation allows inspection and repair processes to focus only on affected segments rather than the entire RDL structure. Defects can be isolated to specific segments, enabling targeted repair actions that minimize impact on overall production throughput and allow parallel processing of unaffected segments.
3Ease of repair
If redundant conductive segments are formed, then defect repair capability is improved, but material usage and process complexity increase
Solution Approach 1:
The patent applies universality by designing redundant conductive segments and alternative routing paths that can serve multiple functions. These redundant structures are not dedicated to specific defect types but can accommodate various defect scenarios including opens, shorts, and routing failures. The same redundant infrastructure provides both defect mitigation and design flexibility, reducing the need for separate repair mechanisms and minimizing additional material requirements.
Data Source
AI summary
The disclosure concerns methods of forming a semiconductor device with a repairable redistribution layer (RDL) design, comprising: preparing an original repairable RDL design; forming first conductive segments of the repairable RDL design; inspecting the first conductive segments of the repairable RDL design to detect manufacturing defects; detecting at least one defect in the first conductive segments; and forming second conductive segments of the repairable RDL design according to a new custom RDL design to mitigate the negative effects of the at least one defect among the first conductive segments. The disclosure also concerns semiconductor devices with a repairable RDL design.