Customizable SiP Packaging With Exposed Pads for Late Component Add-On
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Solution Overview
Problem
Current System-in-Package (SiP) devices are either single-purpose and require extensive redesign for changes or grow in component count and cost when customized, limiting flexibility and efficiency in integrating diverse technologies and applications.
Innovation Solution
A customizable SiP device design that allows for partial packaging with exposed areas for additional components to be added later, using a multi-step process involving a substrate with conductive paths and vias, and a plug to prevent encapsulation, enabling customization without the costs and redesign associated with fully custom SiPs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a SiP device is designed as single-purpose with complete encapsulation, then manufacturing simplicity and initial cost are improved, but adaptability and flexibility for future modifications deteriorate
Solution Approach 1:
The substrate is divided into encapsulated regions and non-encapsulated regions, allowing different portions of the device to have different levels of protection and accessibility. This segmentation enables the device to maintain structural integrity while providing access points for future component additions.
Solution Approach 2:
Conductive pads are prepared and positioned on the substrate surface before encapsulation, and specific areas are deliberately left non-encapsulated in advance. This preliminary preparation enables rapid customization later without requiring extensive redesign or rework of the encapsulation structure.
2Adaptability or versatility
If a SiP device is customized with additional components, then adaptability and functionality are improved, but device complexity and cost increase
Solution Approach 1:
The substrate is designed with universal conductive pads and interconnection structures that can accommodate multiple different component types. The same substrate infrastructure supports various customization scenarios, reducing the need for dedicated complex structures for each specific application.
Solution Approach 2:
Instead of providing all possible customization options through complete structural complexity, the invention provides partial customization capability through non-encapsulated areas. This allows sufficient adaptability for many applications without the excessive complexity of fully configurable designs.
3Ease of operation
If conductive pads are exposed on the substrate surface, then ease of operation for adding components is improved, but protection and reliability of the device deteriorate
Solution Approach 1:
The device surface is segmented into encapsulated protected regions and non-encapsulated accessible regions. This segmentation allows the device to maintain overall protection while providing specific access points for operations, balancing reliability and ease of modification.
Solution Approach 2:
Different regions of the substrate have different properties: encapsulated regions provide protection and reliability, while non-encapsulated regions provide accessibility for component addition. This local differentiation of quality allows simultaneous achievement of protection and ease of operation in appropriate areas.
Data Source
AI summary
Methods and structures for manufacturing one or more System in a Package (SiP) devices, where the functionality of a packaged SiP device may be modified by additional components.