Customized Power Delivery Network for IC Hotspot Elimination
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Solution Overview
Problem
Newer IC technologies face reliability and functionality issues due to hotspots, which are areas with high operating temperatures resulting from increased semiconductor device density and switching frequencies, leading to electromigration and voltage drop problems.
Innovation Solution
A temperature-aware IC design method that establishes a customized power delivery network (PDN) by dividing the initial PDN into identical sections, determining total power consumption, and customizing sections with high consumption to handle additional current, thereby eliminating hotspots and preventing electromigration and voltage drop issues.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If semiconductor device density is increased to improve integration, then productivity is improved, but hotspots are generated causing reliability degradation
Solution Approach 1:
The power delivery network is divided into multiple sections, each independently analyzed for power consumption. This segmentation allows identification of high-consumption sections that would form hotspots, enabling targeted customization of power delivery to each section to prevent temperature-related reliability issues while maintaining high device density.
Solution Approach 2:
The patent applies local quality by customizing the power delivery network for each section based on its specific power consumption characteristics. Sections with high power consumption receive customized power delivery configurations, while other sections use standard configurations. This localized approach addresses hotspot prevention without compromising overall device density and productivity.
2Speed
If device switching frequency is increased to improve performance, then power consumption increases, but hotspots are generated causing voltage drop and electromigration
Solution Approach 1:
The patent performs preliminary analysis of power consumption for each section during the design phase, before the IC is manufactured. By identifying sections with high power consumption due to high switching frequencies in advance, the power delivery network can be customized beforehand to prevent hotspots, voltage drops, and electromigration issues in the final product.
Solution Approach 2:
The methodology incorporates feedback by using the determined power consumption amounts of each section to guide the customization of the power delivery network. The analysis results feed into the design decisions, creating a closed-loop process where power consumption characteristics directly influence power delivery configuration to eliminate harmful effects.
3Reliability
If a customized power delivery network is established for each section to eliminate hotspots, then reliability is improved, but design complexity increases
Solution Approach 1:
The patent manages design complexity by focusing parameter changes on specific sections rather than the entire power delivery network. Only sections with high power consumption undergo customization with modified parameters, while other sections retain standard configurations. This selective parameter change approach improves reliability where needed without unnecessarily complicating the overall design.
4Measurement precision
If power delivery network is divided into multiple sections for analysis, then hotspot identification is improved, but manufacturing process complexity increases
Solution Approach 1:
The power delivery network is divided into multiple sections to enable precise measurement and analysis of power consumption in each region. This segmentation improves hotspot identification accuracy by allowing independent analysis of each section's power characteristics, facilitating targeted design optimizations without significantly complicating the manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the timely generation of IC design layouts that minimize hotspots, enhancing IC reliability and functionality by maintaining operating temperatures below a predetermined threshold.
Implementation Method 1
When the total power consumption amount for the section is greater than the per section total power consumption threshold, a hotspot is indicated and the section is customized in order to handle the additional current in that section (i.e., to limit temperature increases due to a relatively high total power consumption amount in that section)
Data Source
AI summary
Disclosed are temperature-aware integrated circuit (IC) design methods and systems, which establish a customized power delivery network (PDN) for an IC early in the design process in order to generate, in a timely manner, a final IC design layout that can be used to manufacture IC chips that will exhibit minimal hotspots. Specifically, prior to placement of library elements, an initial PDN is established and divided into sections. The library elements are placed. Then, potential hotspots associated with any of the sections are identified and a customized PDN for the IC is established to eliminate the hotspots. That is, for each section, a total power consumption amount is determined. When the total power consumption amount is greater than the threshold, a hotspot is indicated and the section is customized to eliminate the hotspot. Also disclosed is a resulting IC chip structure.