Customized Wireless Earphone Panel Assembly for Comfort and Stability
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Solution Overview
Problem
Current TWS Bluetooth earphones are limited by standard sizes that do not accommodate the varying shapes and sizes of users' ears, leading to discomfort, instability, poor sound insulation, and noise reduction, restricting their application scenarios.
Innovation Solution
A customized wireless earphone design featuring a panel assembly and housing tailored to individual ear shapes, with specific dimensions and edge configurations to fit comfortably and securely, incorporating a panel with unique edge shapes and angles to match the tragus, antitragus, and antihelix, along with a ventilation duct for improved fit and sound quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If standard size TWS Bluetooth earphones are used, then manufacturing cost and production efficiency are maintained, but wearing comfort and stability deteriorate due to inability to accommodate varying ear shapes and sizes
Solution Approach 1:
The earphone is divided into a standardized panel assembly (containing electronics) and a customized housing portion. This segmentation allows the electronic components to be mass-produced using standard panels while only the housing needs customization to fit individual ear shapes, thus improving adaptability without completely increasing manufacturing complexity
Solution Approach 2:
The panel assembly is extracted as a separate standardized module from the customized housing. This extraction enables independent mass production of the panel assembly using standard dimensions, while the housing can be customized without affecting the panel production process, resolving the contradiction between adaptability and manufacturing ease
2Object-affected harmful factors
If in-ear earphone design is used, then sound insulation and noise reduction are improved, but wearing comfort deteriorates due to strong foreign body sensation
Solution Approach 1:
The earphone applies local quality by providing sound insulation only where needed (through the customized housing fitting the ear canal) while keeping the panel portion minimal and non-intrusive. This localized approach maintains noise reduction effectiveness without requiring the panel to cover the entire ear, thus improving wearing comfort
Solution Approach 2:
The design transitions from traditional in-ear insertion to a hybrid approach where the panel lies flat on the ear surface (two-dimensional contact) rather than deep insertion (one-dimensional penetration). This dimensional change provides sound insulation through the customized housing while the flat panel reduces foreign body sensation, improving comfort
3Ease of operation
If semi-in-ear earphone design is used, then wearing comfort is improved, but sound insulation and noise reduction deteriorate
Solution Approach 1:
The earphone design uses asymmetry by combining the flat panel structure (from open-ear design) with an asymmetric customized housing that extends into the ear canal. This asymmetric configuration provides sound insulation on the insertion side while maintaining comfort on the panel side, resolving the contradiction between comfort and noise reduction
4Reliability
If customized housing is implemented, then wearing stability and comfort are improved, but production cost increases
Solution Approach 1:
The product is segmented into standardized panel assemblies and customized housings. The panel assemblies can be mass-produced with consistent quality, while only the housing requires customization. This segmentation limits the cost increase to only the housing portion, maintaining overall production efficiency
Solution Approach 2:
The standardized panel assembly serves as a universal module that can be paired with different customized housings. This universality allows the expensive customized portion to be minimized to only the housing, while the majority of the product (panel assembly) remains cost-effective through standardization
Data Source
AI summary
The present disclosure relates to a customized wireless earphone, which includes a panel assembly and a customized housing. The panel assembly includes a panel, a mainboard, a manipulation device, a charging device, a battery, an antenna device, a sound pickup device, a speaker assembly, and a wireless communication module. The mainboard, the manipulation device, the charging device, the battery, the antenna device, the sound pickup device, the speaker assembly, and the wireless communication module are located in a space formed by the panel and the customized housing.


