Conductive Adhesive Electrode Access in Stacked Optical Devices
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Solution Overview
Problem
Current methods for connecting electrodes in optical devices, particularly in stacked configurations, are cumbersome and inefficient, leading to clumsy integration and unreliable electrical connectivity.
Innovation Solution
A method involving the deposition of electrically-conductive adhesive material on specific parts of the electrodes, followed by cutting the optical device to expose the adhesive material, allowing for direct electrical connection with a driving circuit, thereby establishing reliable and continuous conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If transparent conductive material is connected in-plane using anisotropic conductive film to bond electrode to FPCB, then electrical connection is established, but integration becomes clumsy and difficult when stacking multiple optical devices
Solution Approach 1:
The patent applies preliminary action by pre-depositing conductive adhesive material on the electrode before stacking. This allows multiple optical devices to be stacked first, and electrical connections are established afterward by simply exposing the pre-deposited adhesive material through cutting, eliminating the need for complex in-plane connections during stacking
Solution Approach 2:
The patent segments the electrical connection function from the stacking process. Instead of establishing connections during stacking (which causes complexity), the connection material is separated and prepared in advance on the electrode, then exposed after stacking through selective cutting
2Power
If multiple layers of optical devices are stacked to achieve sufficient optical power, then optical performance is improved, but connecting electrodes becomes very difficult
Solution Approach 1:
The conductive adhesive material is deposited on electrodes before stacking multiple optical devices. This preliminary preparation allows devices to be stacked to achieve required optical power, and connections are established afterward by simple cutting to expose the pre-positioned adhesive material
Solution Approach 2:
The patent transitions from in-plane (2D) connections to through-plane (3D) connections. By depositing adhesive material that extends through the electrode thickness and exposing it via cutting, the connection moves to another dimension, simplifying stacked device integration
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Facilitates efficient, simple, and reliable electrical connectivity between electrodes and driving circuits, enabling the optical device to function effectively in stacked configurations.
Implementation Method 1
electrically connecting a driving circuit of the optical device with the electrically-conductive adhesive material deposited on said part of the given electrode, to provide an electrical connection between the driving circuit and the given electrode
Data Source
AI summary
Disclosed is a method for manufacturing an optical device. An electrically-conductive adhesive material is deposited on a first part of a first electrode deposited on a first substrate. A layer of at least one active material is formed between the first substrate and a second substrate, wherein the first electrode is disposed between the first substrate and said layer, and a second electrode is disposed between the second substrate and said layer. The optical device is cut through the first part of the first electrode, thereby exposing the ECA material deposited on the first part of the first electrode. A driving circuit of the optical device is electrically connected with the ECA material deposited on the first part of the first electrode, to provide an electrical connection between the driving circuit and the first electrode.