Cut QFP Half-Packages for ECU Standardization and EMC
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Solution Overview
Problem
Current semiconductor device packaging solutions, such as Quad Flat Packages (QFPs), face challenges in flexibility and cost due to the need for multiple dedicated external connectivity utilities (ECUs) and package sizes, which compromise signal routing and electromagnetic compatibility (EMC) performance.
Innovation Solution
A semiconductor device is created by cutting a standard QFP package in half, resulting in two identical 'half-packages' with one lead-less side, allowing for the use of existing assembly lines and reducing material and setup costs, while enabling standardization of ECUs and improved assembly line utilization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If standard QFP packages are used with leads on all four sides, then electrical connectivity is provided on all sides, but the number of required ECUs increases and PCB space is wasted
Solution Approach 1:
The patent divides a standard QFP package into two separate half-packages by cutting along a symmetry axis. Each half-package retains functional electrical connectivity through three sides (two original sides plus one cut side), enabling a single ECU design to serve multiple application platforms regardless of whether one or two devices are mounted, thereby reducing the number of dedicated ECUs needed.
Solution Approach 2:
The half-package design creates a universal component that can be mounted in different configurations (single device or paired devices) on the same ECU and PCB layout. The leadless cut side can be positioned to match different mounting scenarios, allowing one ECU design to universally support various application requirements without redesign.
2Ease of manufacture
If concentric footprints are used for different package sizes, then ECU standardization is facilitated, but flexibility in routing signals to the mounting substrate is compromised
Solution Approach 1:
The half-package introduces an asymmetric form factor by removing leads from one side, creating a distinct three-sided lead configuration. This asymmetric design provides unique mechanical and electrical orientation that maintains standardized ECU footprints while enabling flexible signal routing through the available three sides, allowing adaptation to different mounting orientations and PCB layouts.
3Reliability
If dedicated ECUs are designed for each platform, then specific application requirements are met, but package and ECU cost increase
Solution Approach 1:
The half-package design creates a universal component that can be mounted in different configurations (single device or paired devices) on the same ECU and PCB layout. The leadless cut side can be positioned to match different mounting scenarios, allowing one ECU design to universally support various application requirements without redesign.
4Loss of substance
If standard QFP packages are cut in half, then material usage is reduced and assembly line utilization is improved, but additional cutting steps are required
Solution Approach 1:
The patent divides a standard QFP package into two separate half-packages by cutting along a symmetry axis. Each half-package retains functional electrical connectivity through three sides (two original sides plus one cut side), enabling a single ECU design to serve multiple application platforms regardless of whether one or two devices are mounted, thereby reducing the number of dedicated ECUs needed.
Data Source
AI summary
A semiconductor device includes a quadrilateral package with a first pair of opposed sides and a second pair of opposed sides. Both sides of the first pair of opposed sides are provided with electrical contact leads. Only one side of the second pair of opposed sides is provided with electrical contact leads. The side of the second pair of opposed sides without electrical contact leads is a leadless side. That side is not a molded side of the package, but rather is defined by a cut surface.