Cutting Blade Grain Size Ratio for Chipping and Wear
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Solution Overview
Problem
Cutting blades used for hard brittle materials like quartz or ceramics generate significant chipping and wear, despite the use of boron compounds for reduced cutting resistance and heat management, necessitating improved cutting quality and productivity.
Innovation Solution
A cutting blade comprising diamond abrasive grains and boron compound grains, where the average grain size of the boron compound grains is controlled relative to the diamond abrasive grains, fixed with a resin or metal bond, to suppress chipping and wear.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a boron compound is added to the cutting blade to reduce cutting resistance and suppress cutting heat, then the wearing of the cutting blade is suppressed, but the size of chipping generated from the edges of each division line on the back side of the workpiece cannot be sufficiently reduced
Solution Approach 1:
The cutting blade uses a composite structure combining diamond abrasive grains for primary cutting with boron compound grains (B4C or cBN) for lubrication and heat management. This composite material approach allows simultaneous achievement of wear resistance and chipping suppression by leveraging the complementary properties of different materials in specific grain size ratios
Solution Approach 2:
The invention optimizes the grain size parameters by controlling the average grain size of diamond abrasive grains to 5-50 μm and the average grain size of boron compound grains to be greater than 1/5 and less than or equal to 1/2 of the diamond grain size. This specific parameter range achieves the balance between cutting performance and chipping suppression
2Temperature
If the high solid lubricity of the cutting blade is maintained to suppress the generation of cutting heat, then the wearing of the cutting blade is suppressed, but the size of chipping generated on the back side of the workpiece increases
Solution Approach 1:
The invention changes the grain size parameters of boron compound grains to a specific range (greater than 1/5 and less than or equal to 1/2 of diamond grain size) that optimizes both lubricity and chipping suppression, rather than simply increasing or decreasing grain size universally
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The controlled grain size ratio effectively reduces chipping on the workpiece edges and minimizes cutting blade wear, enhancing cutting efficiency and productivity.
Implementation Method 1
a cutting blade including a boron compound... by adding a boron compound to a cutting blade, a cutting resistance can be reduced in cutting a workpiece
Implementation Method 2
A boron compound has excellent solid lubricity. Accordingly, by adding a boron compound to a cutting blade, a cutting resistance can be reduced in cutting a workpiece by using the cutting blade, so that the generation of cutting heat at a point of cutting can be suppressed
Implementation Method 3
the diamond abrasive grains and the boron compound grains are fixed by a resin bond or a metal bond
Data Source
AI summary
Disclosed herein is a cutting blade including diamond abrasive grains and boron compound grains. The average grain size of the diamond abrasive grains falls within the range of 5 μm to 50 μm. The average grain size of the boron compound grains is greater than ⅕ and less than or equal to ½ of the average grain size of the diamond abrasive grains.