Cutting Blade Wear Balancing via Alternating Cut Points
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Solution Overview
Problem
The existing cutting methods for substrates, such as semiconductor wafers, result in uneven wear of the cutting blade's surfaces, leading to a shorter blade lifetime, increased production costs, and higher exchange frequencies due to unbalanced wear patterns during circular cutting.
Innovation Solution
A cutting method where the cutting blade alternately cuts into two symmetrical cut points on either side of the substrate's rotation center, balancing the wear on both surfaces by alternating the cutting points and adjusting the rotation direction, thereby extending the blade's lifetime and simplifying production.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the cutting blade performs circular cutting at a fixed position while the substrate rotates, then the cutting groove is formed accurately, but the cutting blade experiences uneven wear on its surfaces leading to shorter blade lifetime
Solution Approach 1:
The cutting blade is made movable along the rotation axis of the substrate, transitioning from a fixed position to a dynamic position. This allows the blade to alternately cut at two different positions (first and second positions) during rotation, distributing wear evenly across both surfaces of the blade while maintaining accurate groove formation through controlled movement.
2Device complexity
If the cutting blade cuts at a single fixed position, then the cutting process is simple, but the wear on one surface of the cutting blade is excessive requiring frequent blade replacement
Solution Approach 1:
The cutting blade performs periodic action by alternating between two cutting positions during substrate rotation. The blade moves to the first position, cuts a groove, then moves to the second position and cuts another groove, repeating this cycle. This periodic alternation distributes wear evenly, extending blade lifetime and reducing exchange frequency while maintaining process simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively balances the wear on the cutting blade's surfaces, prolonging its lifespan, reducing production costs, and enhancing the efficiency of the cutting process by ensuring even wear distribution.
Implementation Method 1
a cutting blade, which is rotated at a high speed and is positioned above the wafer, is moved downward and cuts a layer of the wafer
Implementation Method 2
the wafer which is cut by the cutting blade is horizontally held on a disc-shaped rotation pedestal (for example, chuck table) by a device (for example, vacuum chucking device)
Data Source
AI summary
A cutting method for substrates includes: preparing a substrate which has a predetermined circular cut line set thereon; chucking the substrate on a surface of a chuck table which is rotatably supported around a rotation axis of the chuck table such that the predetermined circular cut line of the substrate is concentric with the chuck table; disposing a disc-shaped cutting blade having a rotation axis so that the cutting blade faces the substrate; and cutting the substrate along the predetermined circular cut line of the substrate by the cutting blade while rotating the substrate by rotating the chuck table. The substrate has two cut points which are set on one side and the other side of the predetermined circular cut line such that a rotation center of the substrate is positioned between the one side and the other side of the predetermined circular cut line. The cutting blade is disposed so that the rotation axis of the cutting blade perpendicularly crosses the rotation axis of the chuck table. The cutting blade is reciprocatably supported along the rotation axis of the cutting blade, and alternately cuts into the two cut points of the substrate.