Cutting Tray and Sub-Chuck Transfer for Faster Board Changeover
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Solution Overview
Problem
The existing cutting apparatuses for plate-shaped workpieces, such as semiconductor wafers, face inefficiencies in mounting and dismounting adjustment boards due to manual operation, leading to time losses during the dressing process.
Innovation Solution
A cutting apparatus with a sub-chuck table and a transport system that includes a tray and a board transport unit, allowing for automated movement of adjustment boards between the chuck table and the sub-chuck table, utilizing a transport unit to efficiently load and unload boards, and a transport system to move workpieces and trays between apparatuses.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If manual mounting and dismounting of adjustment boards is used, then device complexity is reduced, but productivity decreases due to time loss
Solution Approach 1:
The system divides board handling into separate functional modules: a board transport unit with holding pads for transporting boards, and a tray transport unit for transporting trays. This segmentation allows automated handling while keeping each module's complexity manageable and independent.
Solution Approach 2:
The board transport unit automatically picks up boards from the tray using holding pads and places them on the sub-chuck table without manual intervention. The system serves itself by automating the board mounting and dismounting process, eliminating the need for operator involvement.
2Productivity
If automated board transport is implemented, then productivity improves, but device complexity increases
Solution Approach 1:
The holding pads serve multiple functions: they hold the board during transport, transfer the board between the tray and sub-chuck table, and can be positioned at different locations. This multi-functionality reduces the need for separate specialized components, thereby limiting the increase in device complexity.
Solution Approach 2:
The board transport unit acts as an intermediary mechanism between the tray and the sub-chuck table. It mediates the board transfer process by picking up boards from the tray and placing them on the sub-chuck table, simplifying the overall system architecture while enabling automated handling.
3Loss of time
If manual board handling is used, then ease of operation is maintained, but loss of time increases
Solution Approach 1:
The tray is prepared in advance with multiple boards stacked on it before being loaded into the cutting apparatus. The board transport unit then automatically retrieves boards from this pre-prepared tray and places them on the sub-chuck table as needed, eliminating the need for operators to manually prepare and exchange boards during operation.
Data Source
AI summary
A cutting apparatus includes a chuck table having a holding surface used for holding either a workpiece unit that includes a plate-shaped workpiece supported on an annular frame by a tape or a tray shaped similarly to the annular frame, a rest area used for placing a receptacle that houses the workpiece unit or the tray, a transport unit configured to transport the workpiece unit or the tray between the rest area and the chuck table, the transport unit having a holding pad that holds the workpiece unit or the tray, a sub-chuck table that is disposed sideways of the chuck table and has a holding surface used for holding a board for use in adjusting a cutting unit, and a board transport unit configured to transport the board between the tray held on the chuck table and the sub-chuck table.