CVD Filament Connection Geometry to Prevent Solid Buildup

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Solution Overview

Problem

Conventional electrode filament connection members in CVD methods suffer from deposition and falling off of solids produced in the chamber, which can lead to contamination and operational issues.

Innovation Solution

The design of an electrode filament connection member with a head portion and a rod portion that conforms to the outer shape of the CVD apparatus, featuring a side surface parallel to the axial direction or gradually widened, preventing deposition and falling off of solids by maintaining a continuous surface and using a fine uneven pattern to inhibit lump formation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a conventional electrode filament connection member with a head portion and collar portion is used, then electrical connection between power source and electrode filament is achieved, but solids produced in the chamber get deposited in the recess between head portion and collar portion, develop into large lumps, and fall off causing contamination

Engineering Contradiction:

Improveelectrical connection reliabilityVSAvoidsolid deposition and falling off

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The invention extracts and eliminates the recess structure between the head portion and collar portion that causes solid deposition. By designing the side surface to be substantially parallel to the axial direction or gradually widened, the harmful recess space is removed, preventing solids from accumulating and falling off while maintaining the electrical connection function.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

Instead of having a recessed structure that traps solids, the invention inverts the design by creating a substantially parallel or gradually widened side surface profile. This inversion of the traditional stepped structure prevents solid accumulation by eliminating the recess space where solids would otherwise be trapped and later fall off.

Inventive Principle:

Principle #13The other way round (Inversion)

2Object-affected harmful factors

If the side surface of the head portion is made substantially parallel to the axial direction or gradually widened, then solids are prevented from being deposited and developing into lumps, but the manufacturing complexity increases

Engineering Contradiction:

Improvesolid deposition preventionVSAvoidconnection member manufacturing

Core Design Contradiction:

Object-affected harmful factorsVSEase of manufacture

Solution Approach 1:

The invention changes the geometric parameters of the head portion's side surface from a stepped profile with recesses to a substantially parallel or gradually widened profile. This parameter change in the surface geometry prevents solid deposition while maintaining compatibility with conventional manufacturing methods, as the new profile can be achieved through standard machining or forming processes.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Prevents solids from adhering and developing into large lumps on the connection member, maintaining airtightness and electrical connectivity, thereby reducing contamination and ensuring reliable film formation on the substrate.

Implementation Method 1

The side surface of the head portion is substantially parallel to an axial direction or is gradually widened from the tip end portion toward the outer wall. An outer shape of the side surface of the head portion conforms to an outer shape of the electrode filament connection member when viewed in projection along the axial direction.

Methodology Applied

Scientific EffectSurface geometry effect:

Implementation Method 2

using a fine uneven pattern to inhibit lump formation

Methodology Applied

Scientific EffectSurface texture effect:

Implementation Method 3

maintaining airtightness and electrical connectivity, thereby reducing contamination

Methodology Applied

Scientific EffectPhysical barrier effect:

Implementation Method 4

maintaining airtightness and electrical connectivity

Methodology Applied

Scientific EffectElectrical conduction: Conduction (electrical)

Data Source

PatentUS12606914B2Electrode filament connection member, chemical vapor deposition apparatus, and method for manufacturing recording medium substrate

Publication Date: 2026.04.21 RESONAC HARD DISK CORP

AI summary

An electrode filament connection member configured to be attached so as to pass through an outer wall of a chemical vapor deposition apparatus in which an electrode filament is disposed in a chamber is provided, and to form an electrical connection between a wire from a power source and the electrode filament. The electrode filament connection member includes a head portion attached to the electrode filament, and a rod portion that extends through the outer wall and is connected to the wire. The head portion includes an electrode filament attachment portion at a tip end portion, and a side surface that is parallel to an axial direction or is gradually widened from the tip end portion toward the outer wall. An outer shape of the side surface of the head portion conforms to an outer shape of the electrode filament connection member when viewed in projection along the axial direction.