CVD Film Adhesion on Substrates with Organic Structures
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Solution Overview
Problem
The adhesion of films formed by chemical vapor deposition (CVD) on substrates with pre-existing organic structures is unreliable due to organic residues, leading to peeling and pinhole issues, especially in the manufacturing of liquid ejection heads where organic resin flow path members are involved.
Innovation Solution
A method involving the formation of a protective member on the substrate, followed by the creation of an organic structure at a distance from the protective member, and subsequent removal of the protective member to expose a clean surface for CVD film formation, ensuring high reliability in adhesion without damaging the organic structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If O2 plasma treatment or wet cleaning is used to remove organic residues, then organic contamination is removed, but the organic structure may be damaged or degraded
Solution Approach 1:
The substrate surface is divided into two distinct regions: a first region where the organic structure is formed and a second region where the protective member is formed. This spatial segmentation allows different treatments to be applied to different regions, enabling removal of organic residues in the second region without exposing the organic structure in the first region to damaging treatments.
Solution Approach 2:
A protective member is introduced as an intermediary element that covers the region where organic residues need to be removed. This protective member acts as a barrier during CVD film formation, allowing the process to proceed without directly exposing the organic structure to plasma or chemical treatments that would cause damage.
2Ease of manufacture
If CVD film formation is performed directly on substrate surface with organic residues, then film formation is simplified, but film adhesion becomes unreliable leading to peeling and pinholes
Solution Approach 1:
The substrate surface is segmented into a first region containing the organic structure and a second region for protective member formation. This allows selective processing where organic residues are removed only in the second region, providing a clean surface for reliable CVD film adhesion without requiring complex pre-treatment of the entire substrate surface.
Solution Approach 2:
Different surface conditions are created in different regions: the first region maintains its organic structure while the second region is cleaned of organic residues. This local differentiation enables the CVD film to form with high adhesion in the second region while the organic structure remains intact in the first region.
3Manufacturing precision
If protective member is removed after organic structure formation, then clean surface is exposed for CVD, but organic structure may be damaged during removal process
Solution Approach 1:
The substrate is divided into a first region with the organic structure and a second region with the protective member. This spatial separation ensures that removal processes targeting the protective member do not directly contact or damage the organic structure, as they operate in distinct regions.
Solution Approach 2:
The protective member serves as an intermediary that can be selectively removed from the second region without affecting the organic structure in the first region. The removal process is designed to target specific materials or regions, allowing clean exposure of the substrate surface in the second region while preserving the organic structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach secures reliable adhesion of the CVD film on the substrate surface, minimizing damage to the organic structure and preventing film peeling, while maintaining the integrity of the organic structure and flow path members in liquid ejection heads.
Implementation Method 1
removing the protective member after the formation of the organic structure
Implementation Method 2
forming a film by CVD in a region of the surface of the substrate from which the protective member is removed
Data Source
AI summary
Provided is a method of forming a film on a substrate including: forming a protective member on a surface of the substrate; forming an organic structure on the surface of the substrate, at a distance from the protective member; removing the protective member after the formation of the organic structure; and forming a film by CVD in a region of the surface of the substrate from which the protective member is removed.