CVD Shadow Frame Segmentation for Uniform Deposition
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Solution Overview
Problem
Conventional chemical vapor deposition (CVD) apparatuses create non-deposition areas on substrates due to shadow frames, reducing usable substrate area, causing inefficient thin film deposition and potential substrate damage, along with abnormal plasma discharging.
Innovation Solution
A CVD apparatus design where a tetragonal auxiliary supporting part and shadow frame configuration prevent plasma exposure to the susceptor's top, allowing the entire substrate surface to be exposed for uniform thin film deposition, reducing substrate damage and plasma discharging.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a shadow frame covers the edge of the mother substrate to prevent plasma damage, then the susceptor is protected from plasma, but a non-deposition area is created on the mother substrate reducing usable area
Solution Approach 1:
The shadow frame is divided into a frame body portion and a protrusion portion. The frame body portion covers the susceptor edge to protect from plasma, while the protrusion portion extends toward the substrate without creating a complete shadow, allowing plasma to reach the substrate edge while still protecting the susceptor.
Solution Approach 2:
Different portions of the shadow frame have different functions: the frame body portion provides plasma shielding for the susceptor, while the protrusion portion allows controlled plasma exposure to the substrate edge. This local differentiation resolves the contradiction between protection and deposition coverage.
2Reliability
If a shadow frame covers the edge of the mother substrate to prevent plasma damage, then abnormal plasma discharging is reduced, but the thin layer deposition uniformity is compromised due to non-deposition areas
Solution Approach 1:
The shadow frame is segmented into a frame body portion for plasma shielding and a protrusion portion that extends toward the substrate. This segmentation allows the frame body to stabilize plasma discharge while the protrusion minimizes shadowing effects, enabling uniform thin layer deposition across the entire substrate surface.
Solution Approach 2:
The protrusion portion extends partially toward the substrate but not completely covering it, providing just enough plasma guidance to ensure uniform deposition without creating significant shadow areas. This partial extension resolves the contradiction between plasma stability and deposition uniformity.
3Reliability
If the shadow frame contacts the mother substrate to prevent plasma exposure, then substrate edge protection is improved, but substrate damage may occur
Solution Approach 1:
The shadow frame is segmented into a frame body portion that maintains distance from the substrate and a protrusion portion that provides localized protection. This segmentation allows the frame to protect substrate edges from plasma without requiring direct contact, thereby preventing substrate damage while maintaining protection.
Solution Approach 2:
The protrusion portion acts as an intermediary structure between the shadow frame and the substrate, providing plasma protection through its geometric configuration rather than through direct contact. This intermediary approach protects the substrate edge without compromising substrate integrity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances the usable substrate area, prevents substrate damage, and ensures uniform thin film deposition, increasing the number of manufactured display devices while reducing material costs and plasma-related defects.
Implementation Method 1
a gas is sprayed to the mother substrate 2 through the gas spray part. At this time, plasma is generated between the susceptor 1 and the gas spray part, and a thin layer is deposited on the mother substrate 2 by the plasma
Implementation Method 2
a chemical vapor deposition (CVD) method includes a plasma enhanced chemical vapor deposition (PECVD) apparatus using plasma
Data Source
AI summary
A CVD apparatus includes a process chamber, a susceptor, an auxiliary supporting part, a gas spray part, and a shadow frame. The susceptor may be in the process chamber to support and heat a mother substrate. The auxiliary supporting part may be mounted on the susceptor in a tetragonal frame form to support and heat an edge of the mother substrate supported by the susceptor. The gas spray part may be in the process chamber to face the susceptor and may spray a process gas to the mother substrate. The shadow frame may cover an edge of the auxiliary supporting part and an edge of the susceptor extending from the edge of the auxiliary supporting part.