CVD Source Spraying Member Cooling and Self-Cleaning
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing chemical vapor deposition apparatuses face inefficiencies due to the need for frequent cleaning cycles, which decrease operability and yield, as they require shutting down the apparatus for complex cleaning processes and subsequent reconditioning steps, including moisture and foreign matter removal, and test deposition processes.
Innovation Solution
The apparatus features a detachable source spraying member with a cooling system and a chamber lid design that includes multiple source supplying holes and a jacket for easy cleaning and reduced deposition on source spraying holes, allowing for extended cleaning cycles and improved operability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the source spraying member is cleaned frequently to remove thin film material from source spraying holes, then the manufacturing precision of thin film uniformity is improved, but the productivity decreases due to frequent shutdowns and complex cleaning processes
Solution Approach 1:
The source spraying member performs self-cleaning by detaching from the chamber lid and rotating to spray cleaning solution onto itself, eliminating the need for manual disassembly and intervention. The system cleans itself automatically during the cleaning cycle, reducing operational complexity and time
Solution Approach 2:
The source spraying member is designed with detachable connections and rotational capability, transforming it from a static fixed component to a dynamic movable one. This allows the member to detach for cleaning and rotate to access cleaning solution, enabling efficient self-maintenance without permanent installation
2Productivity
If the cleaning cycle is extended to improve productivity, then the manufacturing precision deteriorates due to accumulated thin film material on source spraying holes
Solution Approach 1:
The source spraying member is cleaned before thin film deposition reaches a problematic level. The automated cleaning system detects when cleaning is needed and performs it proactively, preventing accumulation that would affect thin film uniformity while maximizing operational time between cleanings
3Manufacturing precision
If manual disassembly and cleaning procedures are used, then the manufacturing precision is maintained, but the device complexity and ease of operation worsen due to multiple disassembly and reassembly steps
Solution Approach 1:
The source spraying member automatically performs its own cleaning by detaching, rotating, and spraying cleaning solution onto itself. This eliminates the need for operators to manually disassemble, clean, and reassemble components, dramatically simplifying the cleaning operation while maintaining thorough cleaning effectiveness
4Device complexity
If the source spraying member is fixed in the chamber lid, then the device complexity is reduced, but the ease of repair and cleaning worsens due to inability to easily remove for maintenance
Solution Approach 1:
The source spraying member uses detachable connections (screws or bayonet mounts) instead of permanent fixation, allowing it to be easily removed for cleaning and maintenance. The rotational capability further enhances accessibility by allowing the member to be positioned for optimal cleaning access without complex tooling or disassembly
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances the yield by extending the cleaning cycle of the source spraying member, increasing operable time, and simplifying the cleaning process, thereby improving the overall efficiency and throughput of the chemical vapor deposition process.
Implementation Method 1
a cooling member for cooling a temperature of the source spraying member, the cooling member installed inside the chamber lid
Implementation Method 2
a gaseous ingredient material is firstly supplied to a processing chamber, and then a desired thin film is deposited on a substrate (or wafer) by a chemical reaction
Data Source
AI summary
A chemical vapor deposition apparatus is disclosed, which is capable of improving the yield by an extension of a cleaning cycle, the chemical vapor deposition apparatus comprising a chamber with a substrate-supporting member for supporting a substrate; a chamber lid with plural first source supplying holes, the chamber lid installed over the chamber; plural source supplying pipes for supplying a process source to the plural first source supplying holes; a spraying-pipe supporting member with plural second source supplying holes corresponding to the plural first source supplying holes, the spraying-pipe supporting member detachably installed in the chamber lid; and plural source spraying pipes with plural third source supplying holes and plural source spraying holes, the plural source spraying pipes supported by the spraying-pipe supporting member, wherein the plural third source supplying holes are supplied with the process source through the plural second source supplying holes, and the plural source spraying holes are provided to spray the process source onto the substrate.