CXL HBM Interface Core for Single-Step Protocol Conversion

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Solution Overview

Problem

Existing memory systems face increased latency due to the need for multiple protocol and interface conversions, such as those adhering to the JEDEC standard, which are performed twice, leading to inefficiencies in communication.

Innovation Solution

Implementing a Compute Express Link (CXL) memory device with an HBM interface core that directly converts data transmission to the DFI protocol, bypassing the need for JEDEC interface conversion, thereby reducing the number of conversion steps.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If multiple protocol and interface conversions are performed according to JEDEC standard, then compatibility with existing memory systems is improved, but latency increases and communication efficiency deteriorates

Engineering Contradiction:
ImprovecompatibilityVSAvoidlatency
Core Design Contradiction:
Adaptability or versatilityVSLoss of time

Solution Approach 1:

The patent extracts and removes the intermediate JEDEC interface conversion layer from the data transmission path. By implementing a direct interface between the HBM interface core and the DFI protocol, the patent eliminates unnecessary conversion steps while maintaining compatibility with existing memory systems through selective implementation of only the essential protocol elements.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent introduces a simplified intermediary layer that directly maps HBM interface protocols to DFI protocol without requiring full JEDEC standard compliance. This intermediary enables direct communication between high-bandwidth memory and dual-precision floating-point arithmetic units, reducing latency while maintaining sufficient compatibility for the specific application domain.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Adaptability or versatility

If multiple protocol conversions are performed, then broader system compatibility is achieved, but communication efficiency and performance deteriorate

Engineering Contradiction:
Improvesystem compatibilityVSAvoidcommunication efficiency
Core Design Contradiction:
Adaptability or versatilityVSProductivity

Solution Approach 1:

The patent extracts only the essential protocol conversion functions needed for HBM-to-DFI communication, removing the redundant JEDEC standard compliance layers. This selective extraction maintains compatibility with the specific target system while eliminating performance-detrimental conversion steps.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

Instead of converting HBM protocol through JEDEC standard to DFI (traditional path), the patent inverts the approach by implementing a direct HBM-to-DFI mapping that bypasses the intermediate JEDEC layer entirely, achieving both efficiency and targeted compatibility.

Inventive Principle:
Principle #13The other way round (Inversion)

3Reliability

If JEDEC interface conversion is performed twice, then standard compliance is improved, but device complexity and latency increase

Engineering Contradiction:
Improvestandard complianceVSAvoidinterface conversion complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent removes one instance of JEDEC interface conversion from the data path, retaining only the essential compliance elements needed for reliable operation. This reduces the conversion process from two separate JEDEC compliance stages to a single streamlined implementation.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent merges multiple protocol conversion functions into a single integrated HBM interface core that directly handles HBM-to-DFI translation. This consolidation eliminates the need for separate conversion stages while maintaining necessary standard compliance for reliable system operation.

Inventive Principle:
Principle #5Merging (Combining)

Data Source

PatentEP4530869B1Memory device, CXL memory device, system in package, and system on chip including high bandwidth memory
Publication Date: 2026.04.22 SAMSUNG ELECTRONICS CO LTD
  • EP4530869B1 patent drawingFigure 1A
  • EP4530869B1 patent drawingFigure 1B
  • EP4530869B1 patent drawingFigure 2

AI summary

A compute express link (CXL) memory device may include a high bandwidth memory (HBM) comprising a CXL base die and a plurality of core dies that are sequentially stacked on the CXL base die. The CXL base die may include an HMB interface intellectual property (IP) core configured to convert data transmission and reception between the plurality of core dies and dynamic random access memory (DRAM) in compliance with a CXL specification, and the HMB interface IP core corresponds to a non-Joint Electron Device Engineering Council (JEDEC) standard.