Cyanate Ester Resin Composition for Low-CTE PCB Laminates
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Solution Overview
Problem
Existing cyanic acid ester compounds fail to achieve a balance of low thermal expansion, flame retardance, and heat resistance while maintaining solvent solubility, and resin compositions derived from them are insufficient in properties such as adhesion, heat resistance, and thermal conductivity, leading to issues in semiconductor packaging and printed circuit boards.
Innovation Solution
A cyanic acid ester compound produced by cyanating a thiophene-containing phenol novolac resin, combined with other components like maleimide compounds, to form a resin composition that enhances solvent solubility and results in cured products with low thermal expansion, excellent flame retardance, and high heat resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional epoxy resins are used for high-temperature applications, then heat resistance is improved, but storage stability deteriorates due to premature polymerization
Solution Approach 1:
A polymerization inhibitor is introduced as an intermediary substance to prevent premature polymerization of the epoxy resin at high temperatures during storage. The inhibitor acts as a mediator that suppresses unwanted side reactions while allowing the intended curing process to occur when needed, thus maintaining both heat resistance and storage stability.
Solution Approach 2:
The chemical composition parameters of the epoxy resin system are modified by selecting specific epoxy compounds and adding polymerization inhibitors. This parameter change allows the resin to maintain stability at elevated storage temperatures while retaining the ability to cure properly when required, resolving the contradiction between heat resistance and storage stability.
2Temperature
If high glass transition temperature is achieved through resin modification, then heat resistance is improved, but processability deteriorates
Solution Approach 1:
The molecular structure parameters of the epoxy resin are optimized by selecting specific epoxy compounds with appropriate glass transition temperatures. This parameter adjustment achieves high heat resistance while maintaining adequate processability during manufacturing operations such as molding and lamination.
3Ease of manufacture
If conventional epoxy resin systems are used, then manufacturing simplicity is maintained, but environmental compatibility deteriorates due to harmful emissions
Solution Approach 1:
The chemical composition of the epoxy resin system is modified to eliminate or reduce harmful emissions during processing. This parameter change replaces conventional resins with environmentally friendly alternatives that maintain manufacturing simplicity while improving environmental compatibility by reducing volatile organic compound emissions and other harmful byproducts.
Data Source
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Figure 3
AI summary
The present invention provides a novel cyanic acid ester compound that has excellent solvent solubility and provides a cured product having a low rate of thermal expansion and having excellent flame retardance and heat resistance, and a resin composition containing the compound, etc. The present invention provides a resin composition whose cured product obtained by curing can achieve a printed circuit board excellent in peel strength, glass transition temperature, rate of thermal expansion, rate of water absorption, and thermal conductivity. The present invention provides a resin composition whose cured product obtained by curing can achieve a printed circuit board not only having a high glass transition temperature and low thermal expansibility but being also excellent in flexural modulus and thermal conductivity. The cyanic acid ester compound is represented by the general formula (1):