Cyanate Ester Resin Composition for Printed Wiring Boards

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Solution Overview

Problem

Bisphenol A type cyanate ester resins used in printed wiring boards face limitations in heat resistance, especially under severe conditions, and require high amounts of inorganic fillers for flame retardancy, which compromises moldability and mechanical properties, while halogen-free alternatives with improved heat resistance and flame retardancy are sought.

Innovation Solution

A resin composition incorporating a cyanate ester resin with a specific structure, combined with a non-halogen epoxy resin and a maleimide compound, along with an inorganic filler, to enhance heat resistance, mechanical properties, and flame retardancy without using halogen compounds.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a bisphenol A type cyanate ester resin is used to achieve good dielectric characteristics and adhesive properties, then electric properties and mechanical properties are improved, but heat resistance under severe conditions becomes insufficient

Engineering Contradiction:

Improvedielectric characteristics and adhesive propertiesVSAvoidheat resistance under severe conditions

Core Design Contradiction:

ReliabilityVSTemperature

Solution Approach 1:

The patent combines cyanate ester resin with specific structural features (formula 1 compound) and inorganic fillers to create a composite material that maintains dielectric characteristics and adhesive properties while significantly improving heat resistance under severe conditions.

Inventive Principle:

Principle #40Composite materials

2Object-affected harmful factors

If a bromine flame retardant is incorporated to achieve flame retardancy, then flame resistance is improved, but environmental compatibility deteriorates due to halogen content

Engineering Contradiction:

Improveflame retardancyVSAvoidhalogen compound content

Core Design Contradiction:

Object-affected harmful factorsVSObject-generated harmful factors

Solution Approach 1:

The patent extracts and eliminates halogen compounds from the flame retardant system, replacing them with non-halogen inorganic fillers that provide flame retardancy without environmental harm, achieving both flame resistance and environmental compatibility.

Inventive Principle:

Principle #2Taking out (Extraction)

3Object-affected harmful factors

If an inorganic filling material in a large amount is incorporated to satisfy flame retardancy requirements, then flame resistance is improved, but moldability and appearance deteriorate

Engineering Contradiction:

Improveflame retardancyVSAvoidmoldability

Core Design Contradiction:

Object-affected harmful factorsVSEase of manufacture

Solution Approach 1:

The patent changes the parameters of inorganic fillers by carefully controlling particle size, size distribution, and surface treatment to achieve optimal balance between flame retardancy and moldability, allowing sufficient filler content for flame safety while maintaining good molding properties and appearance.

Inventive Principle:

Principle #35Parameter changes

4Temperature

If a novolak type cyanate ester resin is used to achieve excellent heat resistance and flame retardancy, then heat resistance is improved, but curing degree becomes insufficient under normal curing conditions

Engineering Contradiction:

Improveheat resistanceVSAvoidcuring degree

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

The patent merges novolak type cyanate ester resin with additional cyanate ester components and curing agents to create a synergistic system that achieves both excellent heat resistance and sufficient curing degree under normal curing conditions, overcoming the limitations of using novolak resin alone.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The resulting resin composition exhibits improved heat resistance, elastic modulus, and curability, making it suitable for high-density support printed wiring boards with enhanced industrial practicality and flame retardancy.

Implementation Method 1

a resin composition containing a cyanate ester resin component (A) and at least one component (B) selected from the group consisting of an epoxy resin and a maleimide compound

Methodology Applied

Scientific EffectCuring reaction: Chemical Bonding

Implementation Method 2

heat resistance after moisture absorption

Methodology Applied

Scientific EffectMoisture absorption: Absorption (physical)

Data Source

PatentEP2055728B1Resin composition, prepreg and laminate using the same

Publication Date: 2010.08.04 MITSUBISHI GAS CHEM CO INC

AI summary

A cyanate ester resin composition for a printed wiring board material containing a cyanate ester resin component A comprising a cyanate ester compound represented by the formula (1) and/or an oligomer thereof, and at least one component B selected from the group consisting of an epoxy resin and a maleimide compound, which resin composition is improved in heat resistance and heat resistance after moisture absorption, is excellent in mechanical properties such as elastic modulus and has flame retardancy without a halogen compound, and a prepreg and a laminate each of which uses the resin composition defined as above wherein the resin composition contains the component A and at least the epoxy resin as the component B.