Edge Bead Removal Composition for Metal-Containing Resist
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The semiconductor industry faces challenges in accurately removing edge beads from metal-containing photoresists during the photolithographic process, leading to pattern defects and metal-based contamination, especially when processing smaller features.
Innovation Solution
A composition comprising an organic solvent and a cyclic compound with hydroxy groups is used to effectively remove edge beads from metal-containing resists, which includes coating the composition on the substrate, drying, and heating to form a resist film, followed by exposure and development to create a pattern.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional thinner compositions are used for edge bead removal, then photoresist can be removed from edge and rear surface, but metal-based contamination remains and resist residue is generated
Solution Approach 1:
The patent changes the chemical parameters of the thinner composition by incorporating specific cyclic compounds with hydroxy groups (such as cyclohexane-1,2-diol, cyclopentane-1,2-diol) in controlled concentrations (0.1-10 wt%). This chemical parameter modification enables selective removal of metal-containing resist while leaving metal contamination behind, thereby resolving the contradiction between effective edge bead removal and metal contamination prevention.
Solution Approach 2:
The cyclic compound with hydroxy groups acts as an intermediary substance that mediates between the thinner composition and the metal-containing photoresist. This intermediary selectively interacts with the organic components of the resist, facilitating their removal while being indifferent to metal contaminants, thus solving the contradiction effectively.
2Ease of manufacture
If conventional thinner compositions are used for edge bead removal, then photoresist can be removed from edge and rear surface, but resist residue is generated causing pattern defects
Solution Approach 1:
The patent modifies the compositional parameters of the thinner by incorporating cyclic compounds with specific molecular structures (5-30 carbon atoms, containing hydroxy groups) at optimized concentrations. This parameter change transforms the removal mechanism to achieve complete resist elimination without residue formation, thereby preventing pattern defects while maintaining effective edge bead removal.
Solution Approach 2:
The patent creates a composite thinner composition by combining conventional organic solvents with cyclic compounds containing hydroxy groups. This composite formulation synergistically combines the solvating power of traditional solvents with the selective removing capability of cyclic compounds, achieving complete resist removal without residue and eliminating pattern defects.
3Area of stationary object
If the photoresist is coated on the edge and rear surface of the substrate, then complete substrate coverage is achieved, but indentation and pattern defects occur in subsequent processes
Solution Approach 1:
The patent applies segmentation by separating the substrate surface into two distinct zones: the main processing area (center) and the edge/rear surface area. By using the developed thinner composition, the resist on the edge and rear surfaces is selectively removed while preserving the resist pattern on the main processing area, thus eliminating pattern defects while maintaining complete substrate coverage.
Solution Approach 2:
The patent implements local quality by applying different treatments to different regions of the substrate. The thinner composition with cyclic compounds is applied to selectively remove resist from specific locations (edge and rear surfaces) while leaving the resist pattern intact on the main processing area, thereby achieving both complete coverage and high pattern accuracy.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution reduces metal-based contamination and efficiently removes resist material from the substrate edges and rear surfaces, enabling precise processing and patterning of smaller features.
Implementation Method 1
a composition for removing edge beads from metal-containing resists includes an organic solvent and a cyclic compound substituted with at least one hydroxy group
Data Source
AI summary
Provided are composition for removing edge beads from metal-containing resists, and a method of forming patterns including step of removing edge beads using the same and the composition includes an organic solvent and a cyclic compound substituted with at least one hydroxy group (—OH),wherein the cyclic compound has a carbon number of 5 to 30, andthe cyclic compound has at least one double bond in the ring.