Heat-Curable Resin Composition With Desmear Resistance on Smooth Copper
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Solution Overview
Problem
Existing heat-curable resin compositions face challenges with low adhesivity and desmear resistance when used with copper foils of low surface roughness, leading to resin peeling during the desmear process.
Innovation Solution
A heat-curable resin composition comprising specific aromatic and aliphatic cyclic imide compounds, epoxy resin, curing agents, and inorganic fillers, formulated to provide excellent adhesivity and desmear resistance, with a balanced dielectric performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If specific maleimide compound is used to reduce dielectric tangent and improve adhesion, then dielectric properties and adhesivity are improved, but resin overly melts in desmear process causing peeling
Solution Approach 1:
The patent modifies the chemical composition parameters by incorporating aromatic cyclic imide compounds (with specific molecular weights 5,000-100,000) and aliphatic cyclic imide compounds (with specific molecular weights 100-2,000) in controlled ratios. This parameter adjustment allows the resin to maintain strong adhesion to copper foil while improving resistance to melting during desmear processing, thus resolving the contradiction between adhesivity and desmear resistance.
Solution Approach 2:
The patent creates a composite resin system by combining specific maleimide compounds with aromatic cyclic imide compounds and aliphatic cyclic imide compounds. This composite formulation synergistically balances the high adhesion properties of maleimide compounds with the thermal stability and desmear resistance provided by the cyclic imide compounds, preventing resin peeling during desmear while maintaining strong copper foil bonding.
2Loss of energy
If copper foil surface roughness is reduced to lower conductor loss, then transmission loss is reduced, but adhesion force between resin and copper foil decreases
Solution Approach 1:
The patent adjusts the resin composition parameters by incorporating aromatic cyclic imide compounds and aliphatic cyclic imide compounds with specific molecular weight ranges. These compositional modifications enable the resin to achieve strong adhesion to smooth copper foil surfaces (with reduced roughness for lower conductor loss) by enhancing the resin's bonding characteristics without requiring high surface roughness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves low dielectric tangent and superior adhesivity, ensuring robust bonding and resistance to etching liquids, suitable for high-speed communication applications.
Implementation Method 1
a heat-curable resin composition comprising (A) an aromatic cyclic imide compound having a weight average molecular weight of 5,000 to 100,000; and (B) an aliphatic cyclic imide compound having a weight average molecular weight of 100 to 2,000
Implementation Method 2
an epoxy resin having two or more epoxy groups in one molecule; (D) a curing agent for epoxy resin
Data Source
AI summary
Provided is a heat-curable resin composition that not only has a low dielectric tangent but also is excellent in adhesivity, and that particularly results in a cured product which exhibits an excellent desmear resistance. The heat-curable resin composition includes (A) an aromatic cyclic imide compound having a weight average molecular weight of 5,000 to 100,000, (B) an aliphatic cyclic imide compound having a weight average molecular weight of 100 to 2,000, (C) an epoxy resin having two or more epoxy groups in one molecule, (D) a curing agent for epoxy resin, (E) a curing catalyst, and (F) an inorganic filler, wherein the heat-curable resin composition contains the components (A) to (E) in a total amount of 5 to 99% by mass based on the overall composition.