Cyclic Imide Resin Composition for High-Frequency PCBs

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Solution Overview

Problem

Maleimide resins used in high-frequency printed-wiring boards face challenges with low adhesive force, high melt viscosity, and insufficient glass-transition temperature, which are not adequately addressed by existing materials.

Innovation Solution

A cyclic imide resin composition comprising specific cyclic imide compounds and a curing catalyst, with a weight-average molecular weight range of 2,000 to 1,000,000, designed to achieve low melt viscosity, high heat resistance, high adhesion, and high glass-transition temperature, while maintaining low permittivity and dielectric tangent.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If maleimide resin is used for high-frequency printed-wiring boards, then low permittivity and low dielectric tangent are achieved, but adhesive force is low and melt viscosity is high

Engineering Contradiction:

Improveelectrical properties (low permittivity and low dielectric tangent)VSAvoidadhesive force

Core Design Contradiction:

ReliabilityVSStrength

Solution Approach 1:

The patent combines maleimide resin with polyphenylene ether (PPE) and its derivatives to create a composite resin composition. This composite structure allows the material to maintain the low permittivity and low dielectric tangent of maleimide resin while the PPE component provides improved adhesive force and reduced melt viscosity, thus resolving the contradiction between electrical properties and adhesion.

Inventive Principle:

Principle #40Composite materials

2Reliability

If maleimide resin is used for high-frequency printed-wiring boards, then low permittivity and low dielectric tangent are achieved, but glass-transition temperature is insufficient

Engineering Contradiction:

Improveelectrical properties (low permittivity and low dielectric tangent)VSAvoidglass-transition temperature

Core Design Contradiction:

ReliabilityVSTemperature

Solution Approach 1:

The composite resin composition integrates maleimide resin with polyphenylene ether and its derivatives. The PPE component contributes to raising the glass-transition temperature while the maleimide resin maintains the low permittivity and low dielectric tangent properties, thereby resolving the contradiction between electrical properties and heat resistance.

Inventive Principle:

Principle #40Composite materials

3Reliability

If maleimide resin is used for high-frequency printed-wiring boards, then low permittivity and low dielectric tangent are achieved, but melt viscosity is high

Engineering Contradiction:

Improveelectrical properties (low permittivity and low dielectric tangent)VSAvoidmelt viscosity

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The patent creates a composite resin system where maleimide resin is combined with polyphenylene ether and its derivatives. The PPE component acts as a viscosity modifier that reduces the melt viscosity of the overall composition, improving processability and ease of manufacture, while the maleimide resin maintains the critical low permittivity and low dielectric tangent properties.

Inventive Principle:

Principle #40Composite materials

Data Source

PatentUS12146057B2Cyclic imide resin composition, prepreg, copper-clad laminate and printed-wiring board

Publication Date: 2024.11.19 SHIN ETSU CHEMICAL CO LTD

AI summary

Provided is a resin composition that has a low melt viscosity, and is capable of being turned into a cured product having a high heat resistance, a high adhesion and a high glass-transition temperature, though having a low permittivity and a low dielectric tangent. The resin composition is a cyclic imide resin composition containing:(a) a cyclic imide compound represented by the following formula (1),(b) a cyclic imide compound represented by the following formula (2),and(c) a curing catalyst.