Cyclic Polyphenol Resist Composition for Semiconductor Patterning
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Solution Overview
Problem
Conventional polymeric resist materials face limitations in forming fine patterns due to surface roughness and heat resistance issues, and low molecular weight cyclic polyphenol compounds suffer from low etching resistance, outgassing, and solubility problems in semiconductor production.
Innovation Solution
A cyclic compound with a specific chemical structure, suitable for use in radiation-sensitive compositions, is developed, offering high sensitivity, resolution, and etching resistance, and is used to form a resist pattern and undercoat film with improved optical and thermal properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If polymeric resist materials are used, then film-forming properties are good, but surface roughness increases and manufacturing precision deteriorates
Solution Approach 1:
The patent segments the resist material into two distinct components: a low molecular weight cyclic polyphenol compound (providing smooth surface and high precision) and a polymeric resist material (providing good film-forming properties). This segmentation allows each component to contribute its advantageous properties without the drawbacks of using either component alone.
Solution Approach 2:
The patent creates a composite resist material by combining a low molecular weight cyclic polyphenol compound with a polymeric resist material. The cyclic polyphenol compound (5-50 mass%) provides smooth surface and high manufacturing precision, while the polymeric material (50-95 mass%) ensures good film-forming properties, achieving a synergistic effect that resolves the technical contradiction.
2Manufacturing precision
If low molecular weight cyclic polyphenol compounds are used, then manufacturing precision improves, but etching resistance deteriorates
Solution Approach 1:
The patent segments the resist system into a low molecular weight cyclic polyphenol compound (providing high manufacturing precision) and a polymeric resist material (providing etching resistance). This functional segmentation allows each component to specialize in its strength while the composite system provides both properties simultaneously.
Solution Approach 2:
The composite resist material combines a low molecular weight cyclic polyphenol compound (5-50 mass%) that provides high pattern resolution with a polymeric resist material (50-95 mass%) that provides etching resistance, resolving the contradiction between manufacturing precision and etching resistance through material composition.
3Manufacturing precision
If low molecular weight cyclic polyphenol compounds are used, then manufacturing precision improves, but outgassing increases
Solution Approach 1:
The patent segments the resist material into a low molecular weight cyclic polyphenol compound (providing high pattern resolution) and a polymeric resist material (providing low outgassing). The polymeric component acts as a matrix that suppresses outgassing while allowing the cyclic compound to provide its resolution benefits.
Solution Approach 2:
The composite resist material uses a low molecular weight cyclic polyphenol compound (5-50 mass%) for high pattern resolution combined with a polymeric resist material (50-95 mass%) that suppresses outgassing, achieving both high manufacturing precision and low harmful emissions through synergistic material composition.
4Manufacturing precision
If low molecular weight cyclic polyphenol compounds are used, then manufacturing precision improves, but solubility deteriorates
Solution Approach 1:
The patent segments the resist system into a low molecular weight cyclic polyphenol compound (providing high pattern resolution) and a polymeric resist material (providing good solubility). The polymeric component serves as a soluble matrix that facilitates processing while the cyclic compound provides the resolution enhancement.
Solution Approach 2:
The composite resist material combines a low molecular weight cyclic polyphenol compound (5-50 mass%) that enhances pattern resolution with a polymeric resist material (50-95 mass%) that provides good solubility in conventional developers, resolving the contradiction between manufacturing precision and ease of manufacture through complementary material properties.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The cyclic compound enables the formation of high-resolution, smooth resist patterns with enhanced etching resistance and reduced outgassing, suitable for semiconductor production, while maintaining film-forming properties and heat resistance.
Implementation Method 1
a positive-type resist composition mainly composed of a low molecular weight, cyclic polyphenol compound having at least one phenolic hydroxyl group into which an acid-dissociating functional group is introduced
Data Source
AI summary
A radiation-sensitive composition containing a resist compound having a high sensitivity, a high resolution, a high etching resistance, and a low outgas which forms a resist pattern with a good shape is described. Further described is a method of forming a resist pattern using the radiation-sensitive composition. Still further described are a novel composition for forming a photoresist under coat film which is excellent in optical properties and etching resistance and contains substantially no sublimable substance and an under coat film formed by the composition. Still further described are a radiation-sensitive composition containing a solvent and a cyclic compound having a specific structure, for example, a cyclic compound (A) having a molecular weight of 700 to 5000 which is synthesized by the condensation reaction of a compound having 2 to 59 carbon atoms and 1 to 4 formyl groups (aldehyde compound (A1)) with a compound having 6 to 15 carbon atoms and 1 to 3 phenolic hydroxyl groups (phenol compound (A2)), and a cyclic compound for use in the radiation-sensitive composition.