Cycling Heat Dissipation Module for Thin Portable Devices
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The challenge is to design a compact heat dissipation system for portable electronic devices like tablet PCs, where traditional water-cooled systems are hindered by space constraints, and existing solutions are not suitable for thinner devices.
Innovation Solution
A cycling heat dissipation module that uses a fluid-filled chamber with a heat guiding part and a conducting pipe, where the fluid absorbs heat from a heat generating element, evaporates, and flows through a heat exchanging section to be cooled before returning, reducing the system's volume and noise.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a traditional water-cooled heat dissipation system is used, then heat dissipation efficiency is improved, but the volume of the system increases making it unsuitable for thin portable devices
Solution Approach 1:
The patent utilizes phase transition of the working fluid (evaporation and condensation) to transfer heat. The fluid evaporates at the heat absorption area to absorb heat from the heat generating element, then condenses in the heat dissipation area to release heat, enabling efficient heat transfer in a compact volume without requiring large water tanks or complex cooling systems
Solution Approach 2:
The patent employs a closed-loop fluid circulation system where the working fluid flows through capillary channels and conduits. The fluid circulation is driven by pressure differences created during phase transitions, eliminating the need for external pumps while maintaining continuous heat dissipation in a compact configuration suitable for portable devices
2Length of stationary object
If the heat exchanger size is reduced to fit thin devices, then device thickness is improved, but heat dissipation capacity deteriorates
Solution Approach 1:
The patent incorporates porous materials in the heat absorption area where the working fluid evaporates. The porous structure provides large surface area for heat transfer within a thin profile, enabling efficient heat absorption from the heat generating element while maintaining compact device thickness. The capillary channels within porous materials facilitate fluid distribution and phase change heat transfer
3Volume of moving object
If a compact heat dissipation system is designed, then device portability is improved, but system complexity increases
Solution Approach 1:
The patent integrates multiple functions into unified components: the heat absorption area, heat dissipation area, and fluid circulation pathways are merged into a single integrated heat dissipation device. The conduits serve dual purposes as both structural elements and fluid flow channels, reducing the number of separate components while maintaining effective heat dissipation in a compact form factor
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively reduces the volume of the heat dissipation system, making it suitable for thinner devices while minimizing noise, and enhances heat dissipation efficiency by allowing multiple modules to be configured for various operations.
Implementation Method 1
the heat guiding part is used for conducting the heat generated from the heat generating element
Implementation Method 2
the fluid absorbs the heat generated from the heat generating element, and then the fluid is evaporated
Implementation Method 3
the fluid enters the heat exchanging section. After the fluid is cooled
Implementation Method 4
After the fluid is cooled, it is then returned to the main body
Implementation Method 5
the fluid is pushed into the heat exchanging section through the first outlet by a pressure difference. After the fluid is cooled, it is then pushed back into the second compartment by a pressure difference
Data Source
AI summary
A cycling heat dissipation module is used for removing the heat generated by a heat-generating element of a circuit board and includes at least one main body and at least one conducting pipe. The main body has a chamber and a heat guiding part. The chamber is filled with a fluid and has a wall to divide the chamber into a first compartment and a second compartment adjacent to each other. The heat guiding part is used for conducting the heat generated from the heat generating element. The conducting pipe has a first end, a second end and a heat exchanging section. The fluid is pushed into the heat-exchanging section by the pressure difference after absorbing the heat of the heat guiding part, and then moved to the second compartment.