Cyclization Resin Film Treatment for Low-Temperature Curing
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Solution Overview
Problem
Existing methods for manufacturing cured products using cyclization resins, such as polyimide, do not adequately improve the breaking elongation of films, which is crucial for the reliability and durability of semiconductor devices.
Innovation Solution
A manufacturing method involving the application of a resin composition containing a cyclization resin precursor, followed by a treatment with a liquid containing a basic compound or base generator with an amide group, and subsequent heating to accelerate cyclization, thereby enhancing the breaking elongation of the cured product.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional heating methods are used to cyclize the resin, then the cyclization reaction proceeds, but the film warps and thermal damage occurs
Solution Approach 1:
The invention changes the chemical environment parameter by introducing a basic substance (ammonia, amine, or amide) to catalyze the cyclization reaction. This allows the reaction to proceed at lower temperatures (reducing thermal stress and warping) while maintaining effective cyclization. The basic substance acts as a catalyst that lowers the activation energy required for the imidization reaction, enabling low-temperature processing that prevents film warping and thermal damage.
Solution Approach 2:
The basic substance serves as an intermediary catalyst between the polyimide precursor and the cyclization reaction. Rather than directly heating the film to high temperatures, the basic substance mediates the reaction by facilitating the imidization process at lower temperatures. This intermediary approach allows the cyclization to proceed efficiently without subjecting the film to harsh thermal conditions that cause warping and damage.
2Strength
If high temperature heating is applied to improve cyclization, then the mechanical properties improve, but the film warps and breaks
Solution Approach 1:
The invention changes the chemical parameter by adding a basic substance that catalyzes cyclization, enabling the process to occur at lower temperatures. This produces the same mechanical property improvements as high-temperature treatment but without the harmful effects of warping and breaking. The basic substance creates a more favorable chemical environment for low-temperature cyclization, maintaining film integrity while achieving the desired mechanical strength.
3Reliability
If multiple layers are added to increase insulation, then the insulating properties improve, but the substrate warps due to thermal stress
Solution Approach 1:
The invention changes the processing temperature parameter by using low-temperature cyclization enabled by basic substance catalysis. This allows multiple insulating layers to be processed without exposing them to high thermal stresses that would cause warping. The low-temperature process maintains substrate flatness while still achieving complete cyclization and the required insulating properties of multiple layers.
4Manufacturing precision
If conventional development is performed, then the pattern is formed, but the breaking elongation remains insufficient
Solution Approach 1:
The invention applies preliminary action by treating the developed pattern with a basic substance (ammonia, amine, or amide) before the cyclization heating step. This preliminary treatment prepares the polyimide precursor for more effective low-temperature cyclization, resulting in superior breaking elongation. The basic substance penetrates the patterned film and catalyzes the imidization reaction, enhancing the mechanical properties without requiring high-temperature processing that could damage the fine pattern.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method results in a cured product with improved breaking elongation, maintaining insulating properties and mechanical strength, suitable for harsh environments and large substrate sizes with multiple layers, while allowing low-temperature heating to prevent warping and thermal damage.
Implementation Method 1
a cyclization resin (for example, a resin obtained by imidizing a polyimide precursor) can be formed on the base material
Implementation Method 2
treatment with a liquid containing a basic compound or base generator with an amide group, and subsequent heating to accelerate cyclization
Implementation Method 3
subsequent heating to accelerate cyclization
Implementation Method 4
heating the film after the treatment step
Data Source
Figure 1
AI summary
There is provided a manufacturing method for a cured substance, which makes it possible to obtain a cured substance having excellent breaking elongation, a manufacturing method for a laminate, including the manufacturing method for a cured substance, a manufacturing method for a semiconductor device, including the manufacturing method for a cured substance or the manufacturing method for a laminate, and there is provided a treatment liquid that is used in the manufacturing method for a cured substance. The manufacturing method for a cured substance includes a film forming step of applying a resin composition containing a precursor of a cyclization resin onto a base material to form a film, a treatment step of bringing a treatment liquid into contact with the film, and a heating step of heating the film after the treatment step, in which the treatment liquid contains at least one compound selected from the group consisting of a basic compound having an amide group and a base generator having an amide group.