Cycloalkane Encapsulant for Low Dielectric Semiconductor Packaging
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Solution Overview
Problem
Conventional epoxy resin-based encapsulants have high dielectric coefficients and loss factors at high frequencies, and high viscosity and melting points, making them unsuitable for solvent-free liquid encapsulation materials in semiconductor packaging.
Innovation Solution
A solvent-free encapsulant composition comprising specific ratios of compounds with cycloalkane-derived structures and monoalkenyl aromatic compounds, which cure to form a film with low dielectric coefficients, low dielectric loss factors, and high glass transition temperatures, suitable for high-frequency semiconductor packaging.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional epoxy resin is used as encapsulant material, then good mechanical properties and thermal tolerance are achieved, but dielectric properties at high frequencies are insufficient due to high polarity of hydroxyl groups
Solution Approach 1:
The patent changes the chemical composition parameters by using cycloalkane-derived compounds with specific molecular structures (Formulas I and II) that inherently have lower polarity compared to conventional epoxy resins. This parameter change in molecular structure directly reduces the dielectric coefficient and loss factor at high frequencies while maintaining mechanical and thermal properties through proper compositional ratios.
Solution Approach 2:
The patent creates a composite encapsulant material combining cycloalkane-derived compounds (Components A and B) with inorganic fillers (Component C such as silicon oxide, aluminum oxide, or boron nitride). This composite approach maintains the mechanical strength and thermal tolerance of epoxy-like materials while the organic cycloalkane base provides superior high-frequency dielectric properties.
2Object-affected harmful factors
If conventional low dielectric epoxy resin is used, then dielectric properties are improved, but viscosity and melting point become too high for solvent-free liquid encapsulation
Solution Approach 1:
The patent changes the molecular weight and structural parameters of the base resin by using cycloalkane-derived compounds with specific formulas (I and II). These structural modifications result in lower viscosity and melting point compared to conventional low dielectric epoxy resins, enabling the material to remain liquid at room temperature or near-room temperature for solvent-free encapsulation processes.
Solution Approach 2:
The patent introduces functional groups at specific locations in the molecular structure (vinyl groups at terminal positions in Formulas I and II) that provide reactive sites for crosslinking while keeping the bulk material fluid. This local functionalization allows the resin to maintain low viscosity for easy processing while achieving high dielectric performance through controlled crosslinking density.
3Strength
If epoxy resin with high crosslinking density is used to improve mechanical strength, then strength increases but dielectric loss factor increases due to higher polarity
Solution Approach 1:
The patent changes the chemical composition to use cycloalkane-derived compounds with non-polar or low-polarity backbones. Even when crosslinked to achieve high mechanical strength, the overall polarity of the network remains low because the base structure (cycloalkane rings with alkyl/fluoroalkyl substituents) inherently has lower dielectric loss compared to the polar hydroxyl groups in conventional epoxy networks.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The encapsulant composition achieves low viscosity at room temperature, low dielectric properties, and high glass transition temperatures, meeting the requirements for high-frequency semiconductor packaging processes.
Implementation Method 1
The component (C) is an initiator... the film includes a cured product of the encapsulant composition
Data Source
AI summary
An encapsulant composition and a film are provided. The encapsulant composition includes 20-45 parts by weight of a component (A), 55-80 parts by weight of a component (B) and a component (C). The total weight of the component (A) and the component (B) is 100 parts by weight, and the weight ratio of the component (C) to the component (A) is 1:100 to 5:100. The component (A) includes first compound (A-1) and second compound (A-2), the component (B) is a non-modified inorganic powder or modified inorganic powder, and the component (C) is an initiator. The first compound (A-1) has structure represented by Formula (I) or Formula (II), and the second compound (A-2) is a monoalkenyl aromatic compoundwherein R1, R2, R3, R4, R5, R6, R7, R8, R9, R10, a, b, c, d, e and f are as defined in the specification.