Cylinder Etching Nozzle Orientation for Uniform Processing

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Solution Overview

Problem

Existing cylinder etching apparatuses suffer from non-uniform etching due to unsatisfactory etching solution flow and the issue of remaining etching solution dripping from nozzles, causing soiling of the cylinder.

Innovation Solution

A cylinder etching apparatus with etching solution supply tubes and nozzles oriented obliquely upward, directing the etching solution toward the rotation center of the cylinder, ensuring uniform etching and preventing solution drips by regulating the flow rate through a discharge port.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If nozzles are oriented horizontally or obliquely downward toward the roll to be processed, then the etching solution can be applied to the cylinder surface, but the flow of the etching solution is unsatisfactory causing non-uniform etching

Engineering Contradiction:
Improveetching uniformityVSAvoidetching solution flow
Core Design Contradiction:
Manufacturing precisionVSEase of operation

Solution Approach 1:

The patent inverts the conventional nozzle orientation by directing nozzles obliquely upward instead of downward or horizontally. This reversal changes the etching solution flow direction to impinge against the cylinder surface from below, creating satisfactory flow patterns that ensure uniform etching across the cylinder surface.

Inventive Principle:
Principle #13The other way round (Inversion)

2Object-affected harmful factors

If nozzles are oriented horizontally or obliquely downward, then etching can be performed, but remaining etching solution in the supply tube drops from the nozzles due to gravity causing soiling of the cylinder

Engineering Contradiction:
Improvecylinder soilingVSAvoidnozzle orientation configuration
Core Design Contradiction:
Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

By inverting the nozzle orientation to point obliquely upward, the patent prevents gravity from causing etching solution to drip from the nozzles. The upward orientation counteracts gravitational pull, allowing any remaining solution to stay in the supply tube rather than dropping onto the cylinder and causing soiling.

Inventive Principle:
Principle #13The other way round (Inversion)

3Manufacturing precision

If nozzles are oriented obliquely upward with ejection direction toward the rotation center, then uniform etching is achieved and solution drips are prevented, but the device complexity increases

Engineering Contradiction:
Improveetching uniformityVSAvoidnozzle arrangement
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent applies local quality by positioning nozzles at specific locations along the cylinder longitudinal direction and orienting them at specific oblique angles. Each nozzle is configured with precise local orientation toward the rotation center, creating optimal etching conditions at each location while maintaining overall system manageability.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The apparatus achieves uniform etching and prevents soiling by optimizing the etching solution flow and managing the remaining solution, enhancing the quality of the etching process.

Implementation Method 1

the etching solution ejected from the plurality of ejection nozzles through the at least one etching solution supply tube is caused to impinge against a surface of the cylinder to be processed, to thereby etch the surface of the cylinder to be processed

Methodology Applied
Scientific EffectFluid impingement:

Implementation Method 2

there is no problem that the remaining etching solution in the etching solution supply tube drops from the nozzles due to the gravity

Methodology Applied
Scientific EffectGravity: Gravitation

Data Source

PatentEP3130692B1Corrosion device for cylinder
Publication Date: 2019.04.03 THINK LABORATORY CO LTD
  • EP3130692B1 patent drawingFigure 1
  • EP3130692B1 patent drawingFigure 2
  • EP3130692B1 patent drawingFigure 3

AI summary

Provided is a cylinder etching apparatus, which is capable of performing etching more uniformly than in the prior art and is also capable of solving a problem in that a remaining etching solution in an etching solution supply tube flows down therefrom. The cylinder etching apparatus includes: a processing bath; chuck means; at least one etching solution supply tube; and a plurality of ejection nozzles juxtaposed in the etching solution supply tube and configured to eject an etching solution from the etching solution supply tube. The etching solution ejected from the ejection nozzles through the etching solution supply tube is caused to impinge against a surface of the cylinder to be processed, to thereby etch the surface of the cylinder to be processed. The ejection nozzles are oriented obliquely upward with respect to a horizontal direction. An ejection direction of the ejection nozzle is oriented toward a rotation center of the cylinder to be processed from a position that is obliquely downward of the cylinder to be processed. The ejection nozzles are arranged so as to be brought closer to and away from the surface of the cylinder to be processed.