Cylindrical Connection Terminals for High-Frequency Signal Transmission
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Solution Overview
Problem
Conventional semiconductor apparatuses face difficulties in transmitting high frequency signals due to impedance mismatch at connection terminals, specifically solder balls, which are not suitable for efficient signal transmission between vertically adjacent wiring substrates.
Innovation Solution
The semiconductor apparatus features connection terminals with signal and ground terminals arranged adjacently, having constant intervals between their side surfaces, allowing for improved impedance matching and efficient high-frequency signal transmission. These terminals are designed with a resilient property to absorb thermal stress and are formed from materials like Cu-type alloys, ensuring reliable connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If solder balls are used as connection terminals between vertically adjacent wiring substrates, then the manufacturing process is simple and connection is achieved, but impedance mismatch occurs and high frequency signal transmission is difficult
Solution Approach 1:
The connection terminal shape is changed from spherical to cylindrical with a flat top surface, and the height is specifically controlled to be 0.5 to 2 times the diameter. This parameter change enables the terminal to serve dual functions: maintaining ease of manufacturing through standardized processes while achieving proper impedance matching for high frequency signal transmission through the controlled geometric parameters.
Solution Approach 2:
The invention transitions from a completely spherical shape to a cylindrical shape with a flat top surface. This modification retains the curved body for mechanical connection advantages while adding a flat surface that provides better electrical contact and impedance characteristics for high frequency signals, resolving the contradiction between manufacturing simplicity and signal transmission reliability.
2Ease of manufacture
If conventional spherical connection terminals are used, then manufacturing is easier, but impedance matching is poor and signal transmission efficiency decreases
Solution Approach 1:
By changing the terminal geometry from spherical to cylindrical with specific height-to-diameter ratio (0.5 to 2), the invention achieves better impedance matching while maintaining manufacturability. The controlled parameters allow standard manufacturing processes to produce terminals with precise electromagnetic characteristics for high frequency applications.
3Device complexity
If solder balls are used for connecting wiring substrates, then assembly is simple, but thermal stress resistance is poor and connection reliability decreases
Solution Approach 1:
The cylindrical shape with flat top surface provides better mechanical interlocking and stress distribution compared to spherical terminals. The increased surface area and modified geometry enhance thermal stress resistance while maintaining assembly simplicity, as the terminals can still be placed and connected using conventional processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables effective transmission of high-frequency signals by adjusting impedance and improving connection reliability between wiring substrates, allowing for broader component selection and arrangement flexibility, while also mitigating thermal stress through resilient materials.
Implementation Method 1
The multiple connection terminals include a signal terminal and ground terminals provided on both sides of the signal terminal. The signal terminal and the ground terminals have side surfaces that face each other. The signal terminal and the ground terminals are adjacently arranged, so that intervals between the side surfaces of the signal terminal and the ground terminals are constant from a plan view.
Data Source
AI summary
A semiconductor apparatus includes a first wiring substrate, a second wiring substrate positioned above the first wiring substrate, multiple connection terminals provided between the first wiring substrate and the second wiring substrate and configured to electrically connect the first wiring substrate and the second wiring substrate, an electronic component provided on at least one of the first wiring substrate and the second wiring substrate. The multiple connection terminals include a signal terminal and ground terminals provided on both sides of the signal terminal. The signal terminal and the ground terminals have side surfaces that face each other. The signal terminal and the ground terminals are adjacently arranged, so that intervals between the side surfaces of the signal terminal and the ground terminals are constant from a plan view.